Sign In
Forgot Password?
Sign In | | Create Account

Mechanical Analysis Blog

Posts tagged with 'Package Design'

24 Feb, 2010

Nazita Saye

If you are involved with semiconductor packaging design, then have I got news for you. We just announced the availability of FloTHERM IC – a web-based tool that delivers a high level of automation to design tasks associated with full-spectrum thermal characterization and validation. From what I understand, a typical semiconductor thermal team spends about 60% of their time on standard package thermal

Read More

Semiconductor, ROI, Smart Parts, CFD, BGA Substrates, Thermal Characterization, Validation, Package Design, FloTHERM PACK

Archives

 
Online Chat