Posted Feb 9, 2010, by Nazita Saye
I come across a fair bit of industry research and I read it all. Unfortunately retrieving the information from my brain can be a bit problematic because my brain doesn’t think or store information in a linear fashion. So from time to time I find myself skimming the reports again just to remind myself of the information. These sessions are usually littered with my yelps of “that’s right” and “oh that’s … Read More
Tags:
Simulation,
Engineer,
FloHTERM PCB,
Electronics Cooling,
PCB,
Respin,
FloTHERM,
Mechanical
Posted Dec 12, 2009, by John Wilson
When a person describes their ideal design software, or any software for that matter, Ease-of-Use is always on the list of desirable attributes. It makes sense that in order to be productive with the software in the shortest amount of time the software must be easy to use. All of the CAD and CFD tools I work with strive to achieve this goal (except for one which I won’t name and it isn’t one of our … Read More
Tags:
Data Center,
Ease of Use,
CFD,
Thermal Design,
Electronics Cooling,
PCB
Posted Nov 2, 2009, by Nazita Saye
I think you can learn a lot by doing competitive benchmarking — the act of comparing yourself with your competitors along a certain set of criteria. It can highlight your strengths and weaknesses and it may even help you uncover new opportunities. While you may already be familiar with the concept as it applies to manufactured goods, I’m not sure how many people consider looking at what their competitors … Read More
Tags:
Thermal,
Fan,
FloTHERM,
Analysis,
PCB,
Respin,
Heatsink,
Optimization
Posted Oct 8, 2009, by John Parry
Hmmm…
If you’re guessing it’s a chip package, you’re right – got it in one. Well done!
OK, so what type of package is it?
If you’re thinking it’s a silly question as you don’t know anything about the package, other than I’ve told you its black - that was a hint that it’s an encapsulated plastic part by the way - you’d be right.
You’d need me to tell you if it had leads, and if so on how many sides … Read More
Tags:
PCB,
JEDEC,
Thermal Guideline,
CFD,
Chip Package,
2-Resistor Model,
Thermal Standard,
FloTHERM.PACK,
IC Packaging,
DELPHI Model,
Electronics Cooling
Posted Jun 12, 2009, by Robin Bornoff
The penultimate issue in this series of ‘reasons why an electronics cooling model can be wrong, but hey it’s fine as it will never be perfect but if you take some precautions it will always be useful, Parts 1, 2, 3 ….4, 5′ (Ian Dury, you have nothing to fear) focusses on the representation of PCBs (or PWBs if you are so inclined). Devilishly complex in their construction, deceptively simple in their … Read More
Tags:
FloTHERM,
PCB,
Electronics Cooling