Posted Aug 2, 2010, by Nazita Saye
I believe in simulation and its effectiveness. I’ve seen how much money it can save. I’m also not the most patient person on the face of the planet. Therefore, I like simulation because it can give fast answers to rather big questions. But sometimes you need more. Sometimes you also need to measure the real world.
This is especially true in the world of semiconductors. You see heat dissipation in … Read More
Tags:
Thermal,
T3ster,
CTM,
JEDEC,
characteristics,
package,
Semiconductor,
measurement hardware,
NXP Semiconductors
Posted Feb 24, 2010, by Nazita Saye
If you are involved with semiconductor packaging design, then have I got news for you.
We just announced the availability of FloTHERM IC – a web-based tool that delivers a high level of automation to design tasks associated with full-spectrum thermal characterization and validation.
From what I understand, a typical semiconductor thermal team spends about 60% of their time on standard package thermal … Read More
Tags:
Semiconductor,
ROI,
Smart Parts,
CFD,
BGA Substrates,
Thermal Characterization,
JEDEC,
Package Design,
Validation,
FloTHERM IC,
FloTHERM PACK
