6
Nov, 2009
Just a quick post to let you know yours truly will be giving a presentation on:
Thermal Design: A Key Part of the Electronics Design Flow
At the UK Solutions Expo at the Heritage Motor Centre in Gaydon on 12th November.
Miniaturization continues to increase power densities at all packaging levels, forcing design teams to identify new methods of cooling. The challenge remains consistent at all levels … Read More
Thermal Design, Shortening Design Time, Thermal Management, Electronics Cooling, Cost Saving, PCB Respin, Reliability, FloTHERM.PACK, FloTHERM.PCB