24
Feb, 2010
If you are involved with semiconductor packaging design, then have I got news for you.
We just announced the availability of FloTHERM IC – a web-based tool that delivers a high level of automation to design tasks associated with full-spectrum thermal characterization and validation.
From what I understand, a typical semiconductor thermal team spends about 60% of their time on standard package thermal … Read More
Semiconductor, ROI, Smart Parts, CFD, BGA Substrates, Thermal Characterization, JEDEC, Package Design, Validation, FloTHERM IC, FloTHERM PACK