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Mechanical Analysis Blog

Posts tagged with 'Smart Parts'

24 Feb, 2010

Nazita Saye If you are involved with semiconductor packaging design, then have I got news for you. We just announced the availability of FloTHERM IC – a web-based tool that delivers a high level of automation to design tasks associated with full-spectrum thermal characterization and validation. From what I understand, a typical semiconductor thermal team spends about 60% of their time on standard package thermal … Read More

Semiconductor, ROI, Smart Parts, CFD, BGA Substrates, Thermal Characterization, JEDEC, Package Design, Validation, FloTHERM IC, FloTHERM PACK

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