All Detailed Thermal IC Package Models are Wrong... Probably
‘Rubbish In -> Rubbish Out’ is a well accepted fact in the world of simulation. Regardless of the technical capabilities of your thermal simulation tool, the accuracy of prediction will always be tightly coupled to the accuracy of the input data. The most accurate thermal IC package model is a so called ‘detailed’ model where all the internal construction is represented explicitly … Read More
Tags: Electronics Cooling, detailed thermal IC package models, T3ster, FloTHERM PACK, strucutre functions