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Mechanical Analysis Blog

Posts tagged with 'T3ster'

14 Mar, 2011

Andras Poppe Well, the Christian world needs to wait a couple of more weeks for Easter to come. But the lent of the semiconductor thermal management community is close to finish - at least after a long period of my silence here - since I am writing a new post again. And the reason is that we are facing a very busy week: for the semiconductor thermal management community the week between 20 and 26 March will be like … Read More

RthJC, reliability testing, SEMI-THERM, Electronics Cooling, AC LED, T3ster, LED thermal testing, LM80 tests, TIM testing, JEDEC, JESD51-14

21 Dec, 2010

Andras Poppe I have always admired the medical diagnostic tools, especially imaging. X-rays have a long history, starting with Conrad Röntgen back in the 19th century. In fact in Hungary x-raying is called “röntgening” - yes, like this; the phrase became part of our language as an ordinary word; both as a verb (to take somebody’s x-ray image) or as an adjective to specifically name this very high … Read More

non-destructive analysis, structural analysis, die attach void, thermal transient testing, structure function, T3ster

5 Dec, 2010

LEDs do something cool!

Posted by Andras Poppe

Andras Poppe Today is the 2nd Sunday of Advent. I am preparing for Christmas. Since my childhood I have been really fond of Christmas-trees and candles on the tree. But my father has always been afraid of fire, therefore candles were lit only when my parents were present. It changed  with the strings of  bulbs. They introduced a new game: when decorating the tree, one had to test the string since the low voltage … Read More

LED reliability, FloEFD, T3ster, LED testing, LM80 tests

25 Nov, 2010

Andras Poppe I guess, many people who had to find the metric  known as “theta-JC”  have asked themselves the question great many times: how to measure junction-to-case thermal resistance quickly and accurately?  So did my colleagues at MicReD back in 2004/2005 when they had to do contract measurement of over 80 power transistor packages. The usual answer is: read the relevant standard - such as MIL-883 or … Read More

thetaJC, thermal transient testing, Electronics Cooling, JEDEC, dual interface method, RthJC, T3ster, JESD51, junction-to-case thermal resistance

24 Nov, 2010

On a Wing and a Prayer - Part Deux

Posted by Nazita Saye

Nazita Saye It seems that my previous post resonated deeply with everyone – I received a lot of offline comments and my post inspired two of my colleagues (Boris and Andras) to do their own blog posts. This doesn’t shock me because Thanksgiving week is one of the busiest travel periods in the States so everyone is thinking about flying. So I thought we should stay with the subject for one more day and look at it … Read More

T3ster, Thermal, FloEFD, CFD, LED, QA, FloVENT, hybrid engine

19 Nov, 2010

What Can You Learn When You Turn It On?

Posted by Robin Bornoff

Robin Bornoff Power on an IC package, measure the resulting transient response of the junction temperature and from that infer a wealth of information about the structure of the package that the heat has to flow through. Such a methodology is at the heart of the Mechanical Analysis Division’s T3Ster(pronounced “trister”) product. Some simulation software vendors pitch their products as being able … Read More

MicReD, Electronics Cooling, package level thermal, T3ster

2 Aug, 2010

Measuring the Real World

Posted by Nazita Saye

Nazita Saye I believe in simulation and its effectiveness. I’ve seen how much money it can save. I’m also not the most patient person on the face of the planet. Therefore, I like simulation because it can give fast answers to rather big questions. But sometimes you need more.  Sometimes you also need to measure the real world. This is especially true in the world of semiconductors. You see heat dissipation in … Read More

Thermal, T3ster, CTM, JEDEC, characteristics, package, Semiconductor, measurement hardware, NXP Semiconductors

4 Jan, 2010

Robin Bornoff This series, despite being somewhat lengthy, is by no means a complete overview of the various methods, options and approaches to predicting component temperatures. Here is some stuff I didn’t cover… My bias in this series is towards the prediction of component temperature via simulation using a 3D CFD approach adopted in our (as ever) market leading FloTHERM and FloTHERM.PCB products. 3D CFD is not … Read More

Electronics Cooling, Component, T3ster, Network, Psi

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