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Mechanical Analysis Blog

Posts tagged with 'T3ster'

24 Nov, 2010

On a Wing and a Prayer - Part Deux

Posted by Nazita Saye

Nazita Saye It seems that my previous post resonated deeply with everyone – I received a lot of offline comments and my post inspired two of my colleagues (Boris and Andras) to do their own blog posts. This doesn’t shock me because Thanksgiving week is one of the busiest travel periods in the States so everyone is thinking about flying. So I thought we should stay with the subject for one more day and look at it … Read More

T3ster, Thermal, FloEFD, CFD, LED, QA, FloVENT, hybrid engine

19 Nov, 2010

What Can You Learn When You Turn It On?

Posted by Robin Bornoff

Robin Bornoff Power on an IC package, measure the resulting transient response of the junction temperature and from that infer a wealth of information about the structure of the package that the heat has to flow through. Such a methodology is at the heart of the Mechanical Analysis Division’s T3Ster(pronounced “trister”) product. Some simulation software vendors pitch their products as being able … Read More

MicReD, Electronics Cooling, package level thermal, T3ster

2 Aug, 2010

Measuring the Real World

Posted by Nazita Saye

Nazita Saye I believe in simulation and its effectiveness. I’ve seen how much money it can save. I’m also not the most patient person on the face of the planet. Therefore, I like simulation because it can give fast answers to rather big questions. But sometimes you need more.  Sometimes you also need to measure the real world. This is especially true in the world of semiconductors. You see heat dissipation in … Read More

Thermal, T3ster, CTM, JEDEC, characteristics, package, Semiconductor, measurement hardware, NXP Semiconductors

4 Jan, 2010

Robin Bornoff This series, despite being somewhat lengthy, is by no means a complete overview of the various methods, options and approaches to predicting component temperatures. Here is some stuff I didn’t cover… My bias in this series is towards the prediction of component temperature via simulation using a 3D CFD approach adopted in our (as ever) market leading FloTHERM and FloTHERM.PCB products. 3D CFD is not … Read More

Electronics Cooling, Component, T3ster, Network, Psi

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