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Mechanical Analysis Blog

Posts tagged with 'Thermal Design'

9 Feb, 2010

John Parry I was on a conference call and WebEx yesterday with the NAFEMS CFD Working Group, of which Mentor Graphics is a member. One of the people on the call had a lot of background noise on his phone, which turned out to be a due to a fan by his desk to keep his computer cool. Computational Fluid Dynamics (CFD) is a memory hungry, CPU intensive activity so I guess he was running a fairly substantial case. … Read More

Thermal Management, Thermal Design, Upfront Analysis, Concurrent CFD, Design Process, CFD, Upfront CFD, Kolb's Learning Styles, X-ray Vision, Electronics Cooling, Experiential Learning

8 Feb, 2010

Vision at 40+

Posted by John Wilson

John Wilson I got my eyes checked on Friday and I walked out of there over $400 lighter in the wallet, and I’m covered under two vision insurance policies.  What did I get? An eye exam for contact lenses Some sample cleaner solution A commitment for them to buy 6 months worth of contacts once we determine the pair they prescribed are fitted correctly. $350 worth of contact “fitting”. That last one is … Read More

Thermal Design, Multifocal

3 Feb, 2010

John Parry I’m off to SEMI-THERM later this month. SEMI-THERM is one of the premier thermal management conferences and has the best exhibition by far. The conference runs from 21-25 February, the first two days of which are devoted to professional short courses delivered by a number of leading names in electronics cooling, and past recipients of the IEEE’s THERMI Award. Short courses at SEMI-THERM 26 are eligible … Read More

Thermal Standards, JEDEC JC15, Electronics Cooling, Thermal Design, Thermal Management, SEMI-THERM Conference, SEMI-THERM Exhibition

15 Dec, 2009

The Secret’s Out!

Posted by John Parry

John Parry Mentor’s Thermal Design Software Is The Best. OK, say’s who? It’s the conclusion from some independent research carried out by Aberdeen Research Group. Last time I showed that Aberdeen had found that Mentor’s customers are almost 3 times faster at completing thermal verification than users of other tools. Let’s take a look at why that is. Aberdeen found evidence of what users of other tools were doing … Read More

Thermal Management, Thermal Design, Design Flow, Design Process, CFD, FloTHERM.PCB, PCB Respin, Electronics Cooling

12 Dec, 2009

Hands Free CFD

Posted by John Wilson

John Wilson When a person describes their ideal design software, or any software for that matter, Ease-of-Use is always on the list of desirable attributes. It makes sense that in order to be productive with the software in the shortest amount of time the software must be easy to use.  All of the  CAD and CFD tools I work with strive to achieve this goal (except for one which I won’t name and it isn’t one of our … Read More

Data Center, Ease of Use, CFD, Thermal Design, Electronics Cooling

9 Dec, 2009

Wanna Know a Secret?

Posted by John Parry

John Parry It could save your company a shed load of time and money… Interested? OK, here’s some research by Aberdeen Group, which I presented at several of the recent Solutions Expos. First off, the Mechanical Analysis Division’s customers choose Mentor’s tools because they recognise them as being the best. They don’t just make do with tools available as part of another software suite, as shown below in the … Read More

Thermal Management, Concurrent CFD, Cost Saving, CFD, Fluent Design, Thermal Design, Design Process, Electronics Cooling

4 Dec, 2009

John Parry While I was waiting for the last few people for my presentation ‘Thermal Design: A Key Part of the Electronics Design Flow’ at the UK Solutions Expo at the Heritage Motor Center in Gaydon a couple of weeks back I thought I’d poll the audience with a couple of questions. It’s rare that I get to speak to an audience of electronics engineers, so I was interested to see how they view thermal design. First … Read More

Upfront Analysis, Thermal Design, Design Collaboration, Design Process, Concurrent CFD, FloTHERM.PCB, Fluent Design, FloEFD

13 Nov, 2009

Mind Your Head(room) Again

Posted by John Parry

John Parry Thermal headroom is a concept I’ve been pushing for a few years, but I guess many people aren’t familiar with it, so I thought some additional commentary would be appropriate. Here goes: What I’ve drawn looks pretty simple. Starting from the ambient we can attribute to total temperature rise for some critical IC to a temperature rise in the air, the PCB and/or heat sink, then the temperature rise in … Read More

Thermal Management, Thermal Headroom, Design Flow, Design Process, CFD, FloTHERM.PACK, Thermal Design, FloEFD

6 Nov, 2009

John Parry Just a quick post to let you know yours truly will be giving a presentation on: Thermal Design: A Key Part of the Electronics Design Flow At the UK Solutions Expo at the Heritage Motor Centre in Gaydon on 12th November. Miniaturization continues to increase power densities at all packaging levels, forcing design teams to identify new methods of cooling. The challenge remains consistent at all levels … Read More

Thermal Design, Shortening Design Time, Thermal Management, Electronics Cooling, Cost Saving, PCB Respin, Reliability, FloTHERM.PACK, FloTHERM.PCB

15 Oct, 2009

John Parry I’d expected to be posting about FloTHERM.PACK this time, but I thought I’d better let you know what I’ve been working on the last couple of weeks instead. I’ve been putting together the Mechanical Analysis Division’s presentations for the European Solutions Expos in Finland, The Netherlands, Sweden, and Egypt amongst other places, plus the Alcatel Thales forum in Paris and U2U in Munich. Details of … Read More

Thermal Design, Solutions Expo, Thermal Management, FloTHERM.PACK, Design Process, Saving Cost, Saving Time, FloTHERM.PCB, PCB Respin

13 Aug, 2009

Boris Marovic Hello again, Finally I was able to find some time for the project again. In the first part I showed you the CPU heat sink from Noctua and in this part I’ll show you how I gained the properties that I used for the simplified model of the heat sink. Instead of meshing the narrow space between the 36 metal sheets with a huge amount of cells in addition to the already lots of cells in the whole PC, I will … Read More

Thermal Design, FloEFD, Electronics Cooling, FloEFD Project

3 Aug, 2009

John Parry Thanks to the sterling efforts of Martin Tarr and the UK Electronics Knowledge Transfer Network a free on-line thermal management design guide is now available here. If you scroll down the page you’ll see the following sections: • The need for thermal management • Dealing with the heat • Thermal modeling • The practicalities of cooling • Implementing thermal management Each of these can be expanded … Read More

Thermal Design

8 Jul, 2009

Effusivity Smackdown or Standoff?

Posted by John Wilson

John Wilson One our our engineers attended the short course “Thermal Management from an Industrial Point of View” at SEMI-THERM 25 last March presented by Clemens Lasance and Wendy Luiten.    One of the topics that I found really interesting from the course material was that related to contact temperatures.  More specifically, the contact temperature for two semi-infinite bodies, one of them being you.  After reading … Read More

Thermal Design, Consumer Electronics, Electronics Cooling, Thermal Transient, Contact Temperature, Effusivity

29 Jun, 2009

John Wilson Some time back we were testing a flip-chip package in a top-cold-plate harness to measure the package junction-to-case thermal resistance (ΘJC, RJC).   We performed a number of tests where we were consistently measuring a higher value of thermal resistance than was reported by the vendor.   How could we and the vendor both be correct?!? To understand this further I built an analysis model to study … Read More

Thermal Design, Thermal Testing, Electronics Cooling, Heat Spreading

25 Jun, 2009

Air – Is it Running Out of Gas?

Posted by John Parry

John Parry When I first started working on electronics cooling it was at the end of what people sometimes refer to as the ‘bipolar age’. CMOS had become established, paving the way for PCs with very low power consumption. The cooling challenge was just to get the heat out of the box, making sure there were no major dead spots in the flow that would lead to overheating. Typical problems tended to be quite obvious, … Read More

Thermal Design, Thermal Testing, Electronics Cooling, FloEFD, FloVENT

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