Mechanical Analysis Blog

Thermal headroom is a concept I’ve been pushing for a few years, but I guess many people aren’t familiar with it, so I thought some additional commentary would be appropriate. Here goes: What I’ve drawn looks pretty simple. Starting from the ambient we can attribute to total temperature rise for some critical IC to a temperature rise in the air, the PCB and/or heat sink, then the temperature rise in … Read More

Thermal Management, Thermal Headroom, Design Flow, Design Process, CFD, FloTHERM.PACK, Thermal Design, FloEFD

In “What’s black and stuck on a PCB?” I promised I’d get back to writing about FloTHERM.PACK and how it can really help your thermal modelling by helping you build accurate thermal models of chip packages. Assuming you’ve been using FloTHERM or FloTHERM.PCB without FloTHERM.PACK I guess I first need convince you about why you should bother. To help me do that I’d like to introduce you to the concept … Read More

Thermal Model, DELPHI Model, 2-Resistor Model, IC Packaging, Thermal Headroom, FloTHERM.PACK, FloTHERM.PCB