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Mechanical Analysis Blog

Posts tagged with 'Thermal Resistor'

17 Dec, 2009

Robin Bornoff On the sliding scale of thermal component model representation king of all is a ‘detailed’ model. A 3D definition of all of the internal construction geometry and material properties does away with any of the accuracy inconsistency issues associated with the derived CTM (thermal resistor network type) approach. Despite the fact that all models are wrong a detailed model representation of a package … Read More

Detailed, Component, Thermal Resistor, Package Model

7 Dec, 2009

Robin Bornoff Like a river this blog series is slowing down due to its increased width and depth, that and a lot of travel on my part. So, let’s get it back on track! The previous blog focussed on the relatively well known 2 resistor compact thermal model (CTM) method, its strengths (simple to measure and describe) and its deficiencies (unconfirmed and inconsistent accuracy for different package styles and operating … Read More

Thermal Resistor, Accuracy, BCI, 2R, Package Model, Delphi

8 Nov, 2009

Robin Bornoff Next stop on the avenue of package thermal modelling is 2 resistor CTMs (compact thermal models). Specifically Theta_jb and Theta_jc, the thermal resistance between junction and board and junction and case respectively. Unlike their lowly 1R cousins these two resistances do not purport to include the effects of the package environment (well almost not) as such they should in theory be more BCI (boundary … Read More

BCI, CTM, 2R, Thermal Resistor

12 Oct, 2009

Robin Bornoff Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM (compact thermal model) representation. Here we’ll … Read More

Thermal Resistor, CTM, Component, SPICE, IBIS

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