Posted Dec 21, 2010, by Andras Poppe
I have always admired the medical diagnostic tools, especially imaging. X-rays have a long history, starting with Conrad Röntgen back in the 19th century. In fact in Hungary x-raying is called “röntgening” - yes, like this; the phrase became part of our language as an ordinary word; both as a verb (to take somebody’s x-ray image) or as an adjective to specifically name this very high … Read More
Tags:
non-destructive analysis,
structural analysis,
die attach void,
thermal transient testing,
structure function,
T3ster
Posted Nov 25, 2010, by Andras Poppe
I guess, many people who had to find the metric known as “theta-JC” have asked themselves the question great many times: how to measure junction-to-case thermal resistance quickly and accurately?
So did my colleagues at MicReD back in 2004/2005 when they had to do contract measurement of over 80 power transistor packages. The usual answer is: read the relevant standard - such as MIL-883 or … Read More
Tags:
thetaJC,
thermal transient testing,
Electronics Cooling,
JEDEC,
dual interface method,
RthJC,
T3ster,
JESD51,
junction-to-case thermal resistance
