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Mechanical Analysis Blog

Posts tagged with 'Thermomechanical reliability'

15 May, 2014

John Parry Come and join us for THERMINIC 2014 in London! The first deadline for abstract submissions to the 20th IEEE Workshop on THERMAL INVESTIGATIONS OF IC’s AND SYSTEMS (THERMINIC 2014) to be held at the magnificent World Heritage Site in Greenwich, London, has now passed. We’ve had a great response to the first call for abstracts, with more abstracts submitted this year compared to last year. The quality … Read More

Thermal measurements, THERMINIC, Compact Thermal Models, CTMs, CFD, power electronics, Thermomechanical reliability

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