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Mechanical Analysis Blog

Posts tagged with 'Theta_jc'

22 Feb, 2013

Robin Bornoff The JESD51-14 standard was published in November 2010, prepared by the  JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This is the thermal resistance between the die and the package case face. More specifically the face of the package that is to be cooled by an external heatsinking method. Theta_jc … Read More

JESD51-14, Theta_jc

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