Electronics Cooling

World Leader in Electronics Cooling Hardware and Software

Mentor Graphics is the clear market and technology leader of thermal analysis software for the electronics industry. It has led the market with thermal simulation and analysis solutions for over a decade and has developed the largest installed base of any thermal design tool provider.

Using Mentor Graphics Computational Fluid Dynamics (CFD) software, engineers can efficiently predict airflow and heat transfer in and around electronic devices, which run at faster speeds and dissipate more power with every new generation.

Engineering Challenges

Airflow Optimization
One of the primary issues with electronics cooling is airflow optimization – how to ensure the devices receive the right amount of natural or forced ventilation delivered and in the most effective way possible. CFD can help you to not only visualize the flow but also optimize it. More

Package Thermal Design and Characterization
Thermal management is a vital aspect of package design. Mentor Graphics’ thermal design software ensures correct package performance, confirmed by measurement hardware that characterizes active die across all package families including system-in-package, stacked-die and MCMs. More

PCB Thermal Design
Power consumption at board-level is increasing, forcing the use of heat sinks. However, heat sinks added in late design can have a disastrous effect on downstream components in the wake of the heat sink; thus resulting in multiple board respins. Reduce PCB respin by using thermal design software. More

Package Junction and Case Temperature Prediction
Accurate temperature prediction is essential to meet internal design rules yet avoid costly overdesign. Vendors specify maximum temperature limits, making accurate prediction essential for warranty compliance. More

Heatsink Selection and Design
The performance, reliability and life expectancy of electronic equipment are all strongly influenced by component temperature. Design the best heatsink solution to enhance heat dissipation from your hottest components with the help of thermal simulation. More

Fan Selection
Using “guesstimates” to choose suitable fans may result in over-engineering or worse yet in selecting a fan which doesn’t provide enough cooling air. Select the best fan for the job by understanding which fan best matches your system pressure drop curve. More

Electronics Cooling Tools

  • FloTHERM® FloTHERM is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation.
  • FloTHERM®.PCB FloTHERM.PCB is a radical new collaboration tool for product marketing, electrical and mechanical engineers that accelerates the conceptual thermal design of printed-circuit boards.
  • T3Ster T3Ster® is an advanced thermal testing tool for thermal characterization of semiconductor chip packages. Its high precision hardware and advanced software provides the best thermal testing solution available worldwide.
  • FloVENT® FloVENT is a powerful Computational Fluid Dynamics (CFD) software that predicts 3D airflow, heat transfer, contamination distribution and comfort indices in and around buildings of all types and sizes; including data centers.
  • FloEFD™ Embedded into major MCAD systems including Pro/ENGINEER, CATIA, SolidWorks and tightly integrated with Siemens NX, Inventor and SolidEdge, Concurrent FloEFD is a full-featured 3D fluid flow and heat transfer analysis package without the numerical complexity and meshing overhead of traditional CFD.
  • FloTHERM®.PACK FloTHERM.PACK automates the creation of simulation-based semiconductor packages, thermal characterization, and the key tasks in semiconductor package design.
  • TERALED® TERALED offers combined thermal and radiometric/photometric characterization of high-power LEDs, either as a stand-alone optical measurement system or as an add-on to T3Ster.

blogs

FREE Exhibition at SEMI-THERM, Santa Clara February 23-24

John Parry’s Blog

I’m off to SEMI-THERM later this month. SEMI-THERM is one of the premier thermal management conferences and has the best exhibition by far. The conference runs from 21-25 February, the first two days of…View Blog Post

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Robin Bornoff's blog

Computational Fluid Dynamics, CFD, is a simulation technology that provides 3D predictions of fluid flow and heat transfer for a modelled system. Be it an electronics enclosure or a building, insights into…View Blog Post

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Using CAD-embedded CFD upfront and throughout the design process is the only way to go when it comes to compressing design schedules. We call this approach Concurrent CFD, as the CFD analysis can be done…View Blog Post

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