Electronics Cooling
World Leader in Electronics Cooling Hardware and Software
Mentor Graphics is the clear market and technology leader of thermal analysis software for the electronics industry. It has led the market with thermal simulation and analysis solutions for over a decade and has developed the largest installed base of any thermal design tool provider.
Using Mentor Graphics Computational Fluid Dynamics (CFD) software, engineers can efficiently predict airflow and heat transfer in and around electronic devices, which run at faster speeds and dissipate more power with every new generation.
Engineering Challenges
Airflow Optimization
One of the primary issues with electronics cooling is airflow optimization – how to ensure the devices receive the right amount of natural or forced ventilation delivered and in the most effective way possible. CFD can help you to not only visualize the flow but also optimize it. More
Package Thermal Design and Characterization
Thermal management is a vital aspect of package design. Mentor Graphics’ thermal design software ensures correct package performance, confirmed by measurement hardware that characterizes active die across all package families including system-in-package, stacked-die and MCMs. More
PCB Thermal Design
Power consumption at board-level is increasing, forcing the use of heatsinks. However, heatsinks added in late design can have a disastrous effect on downstream components in the wake of the heatsink; thus resulting in multiple board respins. Reduce PCB respin by using thermal design software. More
Package Junction and Case Temperature Prediction
Accurate temperature prediction is essential to meet internal design rules yet avoid costly overdesign. Vendors specify maximum temperature limits, making accurate prediction essential for warranty compliance. More
Heatsink Selection and Design
The performance, reliability and life expectancy of electronic equipment are all strongly influenced by component temperature. Design the best heatsink solution to enhance heat dissipation from your hottest components with the help of thermal simulation. More
Fan Selection
Using “guesstimates” to choose suitable fans may result in over-engineering or worse yet in selecting a fan which doesn’t provide enough cooling air. Select the best fan for the job by understanding which fan best matches your system pressure drop curve. More
Electronics Cooling Tools
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FloTHERM®
FloTHERM® is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation.
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FloTHERM XT
FloTHERM XT is an industry unique thermal simulation solution designed to be used during all stages of the electronics design process – from conceptual design to manufacturing, improving product quality, reliability and time-to-market.
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FloTHERM® PCB
FloTHERM PCB is a radical new collaboration tool for product marketing, electrical and mechanical engineers that accelerates the conceptual thermal design of printed-circuit boards.
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FloTHERM® PACK
FloTHERM PACK automates the creation of simulation-based semiconductor packages, thermal characterization, and the key tasks in semiconductor package design.
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FloTHERM® IC
FloTHERM® IC is a web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design.
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FloEFD™
Award winning FloEFD. Embedded into major MCAD systems, FloEFD is a full-featured 3D fluid flow and heat transfer analysis simulation tool to help Design Engineers optimize product design and speed up their workflow. Better products, faster.
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FloVENT®
FloVENT is a powerful Computational Fluid Dynamics (CFD) software that predicts 3D airflow, heat transfer, contamination distribution and comfort indices in and around buildings of all types and sizes.
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T3Ster
MicReD’s flagship product, T3Ster®, is an advanced transient temperature measurement system which enables rapid and extremely accurate thermal characterization of semiconductor device packages or even complete electronic systems. A scalable solution, it offers the best price/performance ratio in the market.
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T3Ster TeraLED
T3Ster® TeraLED® is a specialist solution for obtaining highly accurate measurements for power LEDs. It offers combined thermal and radiometric/photometric characterization of high-power LEDs, either in combination with T3Ster or as a stand-alone system.
Blogs
Why Not Just Shove a Heatsink on Top of it? Part 1
A common enough question. Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. They should be called ‘area extenders’ as heat does not just disappear into…View Blog Post
Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology
In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is modelled explicitly, no abstraction into a thermal resistor equivalent model, no hiding all…View Blog Post
CFD - Colourful Friday Distractions
By way of an apology for the more verbose blogs I’ve been issuing recently I’d like to present you with a blog that serves no other purpose than to show a pretty picture. CFD as an acronym has…View Blog Post