Fan Selection and Modeling
Choose the right fan for the right job
Fans in electronic devices have the sole purpose of cooling components. Therefore, selecting the right fan is of utmost importance.
Mentor’s family of electronics cooling tools can help you choose the best fan meeting the design specifications for power, longevity, energy efficiency and acoustics. In addition, consider external effects such as inlet and discharge conditions during the selection process because those issues could not only affect fan performance but also adversely affect other components to ensure that their thermal issues are solved before concept commitment.
Simulation Benefits for Modeling and Selecting Fans
- Optimize location of fan to ensure the best possible airflow
- Achieve required airflow and minimize noise without over-engineering the design
- Powerful visualization tools enable you to understand fan performance
- Conduct cost effective “what-if” analysis by using multiple fans and in different locations to find the ideal fan for the design
This presentation will walk through a sample of a fan selection exercise and demonstrate the techniques necessary to accurately analyze the fans in their operating environment. View Video
Thermal Simulation Helps Design New Telecom Platform
"Simulation gave me the freedom to consider a wide range of alternative designs by letting me evaluate their performance quickly and at very little cost. A single thermal simulation gives you a detailed understanding of what is going on inside the box and helps you quickly identify the root causes of the problem.
We made the chassis design modular so that fan configuration could be switched between push and push-pull and the size of the plenums could be adjusted. The result is that the TurboFabric not only meets the thermal requirements of the foreseeable future but can be upgraded to provide a future-proof solution for telecommunications equipment manufacturers."
Dave Watson, Thermal Design Team Leader - Simclar Group
Thermal Simulation Helps Redback Networks Create First Million-Subscriber Platform
Redback Networks set out to create the first million-subscriber platform for triple-play services such as high definition television (HDTV), high density video on demand (HD VoD) and broadband mobility. To obtain this improvement in performance and functionality, power dissipation of the line cards increased twofold relative to the previous generation.
This created a thermal management problem since key application specific integrated circuits were already close to their junction temperature specifications. Redback Mechanical Engineer Wendy Lu overcame this challenge by simulating airflow and heat transfer within the enclosure. By optimizing plenum geometry and using a higher performing fan, she was able to double the system airflow. The new platform is just going into production but it has already been selected by one of the top 20 telephone carriers in the world, ChungHwa Telecom (CHT) of Taiwan.
Reducing Development Costs and Time-to-Market for IFR's Signal Generators
Flomerics Thermal Design Services played a crucial role in significantly reducing development costs and time-to-market for IFR's ultra compact IFR 3410 range of RF signal generators for the wireless test market, which combine wide frequency cover and high performance digital modulations in a small package.
Analysis revealed that a fan mounted on an enclosure within the product's RF compartment was causing heated air to re-circulate, while the effect of a finned heatsink was identified as being paradoxical. Through further analysis the team identified a solution that enabled both the fan and the heatsink to be omitted from the design, thus reducing the product's cost andacoustic emissions.
Simulation Overcomes Challenge of 14U Chassis with 1700 Watts
A network equipment supplier conceived of a new data communications product capable of providing dramatic improvements in performance. But these improvements came at the price of exceptionally high power dissipation. This provided a tough thermal challenge in the telecom central office where equipment must fit within tight space constraints and demonstrate the ability to operate even after fan failures.
The network supplier asked Amphenol TCS, the backplane supplier, to perform thermal simulation in the concept phase to verify the viability of the new chassis concept. Amphenol simulated the product, which includes a total of fourteen 100-Watt and two 150-Watt printed circuit boards (PCBs). They evaluated a series of different chassis sizes and fan types and configurations and finally identified a design that met the requirements.
“This project demonstrates how thermal simulation can be used in the early stages of the design process to minimize expensive late-stage changes and reduce time to market,” Chris Heard, Engineer - Amphenol
Fan Selection Thermal Design Tools
FloTHERM® is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation.
FloTHERM XT is an industry unique thermal simulation solution designed to be used during all stages of the electronics design process – from conceptual design to manufacturing, improving product quality, reliability and time-to-market.
Award winning FloEFD. Embedded into major MCAD systems, FloEFD is a full-featured 3D fluid flow and heat transfer analysis simulation tool to help Design Engineers optimize product design and speed up their workflow. Better products, faster.