Package Junction and Case Temperature Prediction
Adhere to design rules and meet vendor part specifications.
Mentor Graphics has a long history of helping package vendors design more thermally-efficient packages and system integrators improve the accuracy of their part temperature prediction.
Miniaturization continues to increase power densities. As design margins are squeezed, systems integrators are finding it harder to keep components below their maximum specified operating case temperature or junction temperature.
Consequently, accurate component temperature prediction has never been so important. Package vendors must improve the thermal performance of their products and provide thermal models and data to their customers..
Simulation Benefits of Package Junction and Case Temperature Prediction
- Create accurate chip package thermal models and thermal metrics
- Choose the most suitable package type for your product
- Use system- and board-level thermal simulation to improve product thermal design
- Conduct “what-if” testing on package designs without the time and expense of building physical prototypes
An engineer from Texas Instruments demonstrates use of thermal simulation to design FET die layout and performance in the automotive industry. View Video
Package Junction Tools
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FloTHERM®
FloTHERM® is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation.
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FloTHERM® PACK
FloTHERM PACK automates the creation of simulation-based semiconductor packages, thermal characterization, and the key tasks in semiconductor package design.
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FloTHERM® PCB
FloTHERM PCB is a radical new collaboration tool for product marketing, electrical and mechanical engineers that accelerates the conceptual thermal design of printed-circuit boards.
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FloTHERM® IC
FloTHERM® IC is a web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design.
Datasheets
Toolbox
- White Paper: DELPHI Compact Models Revolutionize Thermal Design
- White Paper: Design Characteristics of High Performance and Reduced Cost Chip Scale Package - µBGA
Contact Mentor Graphics
- Request Information or call toll free: 1-800-547-3000