FloTHERM Fremont User Meeting - Mastering Command Center
Mastering Command Center- FloTHERM User meeting
This user meeting will be a review of how to best use Command Center for optimization and simulation control. Starting with parametric studies to rapidly explore different design variations and scenarios, to design of experiments for evaluating manufacturing variance, through to optimization methods - please come to refresh your knowledge and skills with other users.
Please join this complimentary session and feel free to invite any colleagues. If you have a questions on the session before hand, please email us
We look forward to seeing you at our offices and as always, provide you with the very latest information!
What You Will Learn
- Features and functionality in the FloTHERM Command Center
- Defining parametric studies and the range of simulation control available.
- Design of Experiments capabilities
- Optimization methods
- Grid independence/sensitivity examples
About the Presenter
Travis Mikjaniec received an MS in Aerospace Engineering from Carleton University in 2006, with a research focus on rotorcraft aerodynamics and aeroelasticity. He has been with Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) for 6 years specializing in the application of CFD Analysis to the design of electronics equipment. Prior to this he worked for the National Research Council of Canada's (NRC) Institute for Aerospace Research (IAR) Flight Research Laboratory focusing on flight tests and also worked at the NRC's IAR Aeroacoustic and Structural Dynamics Laboratory in experimental testing of smart structures. Travis is currently a Thermal Engineer in the Mechanical Analysis Division engineering team, training and supporting customers doing Thermal Analysis for electronic systems. Travis has experience not only in the use of software, but also of the general design processes and the best way to apply the CFD techniques solve real world problems encountered by engineers.
Who Should Attend
- FloTHERM Users (past and present)
- Engineering tools managers
Reliability in Networking and Telecom Systems – Managing Excessive Heat
The main source of heat in electronic equipment is their semiconductor chips, and the temperature sensitivities of these chips presents a challenge in designing cooling solutions. Overheating causes the...
12 Key Considerations in Enclosure Thermal Design… A High-Level ‘How To’ Guide
Why is Enclosure Thermal Design Important? Before we look at the 12 key considerations in enclosure thermal design let´s first consider why thermal issues need to be considered at the system, or enclosure...
10 Tips for Streamlining PCB Thermal Design… A High-Level ‘How To’ Guide
Many aspects of a PCB’s performance are determined during detailed design, e.g. making a trace a specific length for timing reasons. Timing issues are also affected by temperature differences between components....