Optimize Chassis, Venting and Airflow Design in Electronics Enclosures Web Seminar
On-demand Web Seminar
Optimizing airflow in and around electronics is a key area of concern regardless of project size: whether it’s a 50,000 square foot data center, a high-powered board placed inside a computer or any other type of electronics device. Any change, however minute, to the chassis, layout and components can dramatically alter the thermal and flow behavior inside the electronics enclosure. Simulation is the key to ensuring that the right amount of natural or forced ventilation is delivered to the various components and in the most effective way possible.
During this 45-minute presentation, we will show you how simulation can help you optimize airflow and resolve heat transfer issues inside electronics enclosures. A wide range of topics will be discussed including changing the chassis shape, modifying the layout, as well as changing fans, heatsinks and guide vanes. As design for manufacturability and cost are always key factors in the decision-making process, we will also spend some time on how you can optimize the design while aiming to reduce costs. Design engineers involved in designing electronics enclosures would find this session very educational.
What You Will Learn
- Reduce the delta T through an electronics application through modifications made to the chassis and venting
- Visualize the change in airflow and thermal behavior with every design alteration and understand the underlying causes of problems
- Quickly set-up various what-if scenarios for analysis
- Use sequential optimization by specifying a design goal and letting the software automatically optimize for form, fit, function, cost, material and more
- Select the best design generated from quantified outputs
About the Presenter
Located in the divisions head office in Hampton Court, London, Martin is an Application Engineer with the Mechanical Analysis Division and has been with the organisation for 3 years. Martin holds a BEng degree in ‘Motor Sport Engineering’ which he gained from the University of Central Lancashire and has been heavily involved with Computational Fluid Dynamics (CFD) since 2004.
Who Should Attend
- Engineers who have thermal problems with electronic based applications
- Technical Managers, Thermal Engineers as well as Board and Chassis Engineers
What do I need to watch and hear this web seminar?
Mentor Graphics’ web seminars are delivered using Adobe Connect. You will be able to login to the seminar room 15 minutes prior to the start time on the day of the presentation. You can hear the audio using your computer’s speakers via VoIP (Voice over IP) and background music will play prior to the beginning of the presentation.
Detailed system requirements
- Windows XP, Windows Vista, Windows 7, Windows 8
- Microsoft Internet Explorer 7, 8, 9, 10; Mozilla Firefox; Google Chrome
- Adobe® Flash® Player 10.3 or later
- 1.4GHz Intel® Pentium® 4 or faster processor and 512MB of RAM
Mac OS X, 10.5, 10.6, 10.7.4, 10.8
- Mozilla Firefox; Apple Safari; Google Chrome
- Adobe Flash Player 10.3
- 1.83GHz Intel Core™ Duo or faster processor and 512MB of RAM
- Ubuntu 10.04, 11.04; Red Hat Enterprise Linux 6; OpenSuSE 11.3
- Mozilla Firefox
- Adobe Flash Player 10.3
- Apple supported devices: iPad, iPad2, iPad3; iPhone 4 and 4 S, iPod touch (3rd generation minimum recommended)
- Apple supported OS versions summary: iOS 4.3.x, 5.x, or 6.x (5.x or higher recommended)
- Android supported devices: Samsung Galaxy Tab 2 (10.1), Samsung Galaxy Tab (10.1), ASUS Transformer, Samsung Galaxy Tab (7”) , Motorola Xoom, Motorola Xoom 2, Nexus 7
- Android supported OS versions summary: 2.2 and higher
- Android AIR Runtime required: 3.2 or higher
- Bandwidth: 512Kbps for participants, meeting attendees, and end users of Adobe Connect applications. Connection: DSL/cable (wired connection recommended) for Adobe Connect presenters, administrators, trainers, and event and meeting hosts.
10 Tips for Predicting Component Temperatures… A High-Level ‘How To’ Guide
Component temperature prediction is important from a number of points of view. Historically component temperature has been correlated with reliability, with early studies relating field failure rates to...
25 Years of FloTHERM
FloTHERM® is powerful 3D computational fluid dynamics (CFD) software that predicts airflow and heat transfer in and around electronic equipment, from components and boards up to complete systems.