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Testing Thermal Interface Material (TIM) Analysis

Overview

This webinar will provide an introduction to the most commonly used Thermal Interface Material (TIM) types and their corresponding testing techniques. Basic TIM properties such as bulk or effective thermal conductivity, interfacial thermal resistance and bond line thickness will be explained. At the beginning, an overview of the existing industrial and experimental test methods aimed at measuring the thermal conductivity of these materials. The ASTM D-5470 steady state TIM testing standard will be explained and evaluated. In the second part of the presentation newly developed test setups will be shown which mean an enhancement to the existing standard, including a possible in-situ solution. These new approaches will be explained in detail and measurement results will be shown. In the final part of the presentation the presenter will discuss the importance of the evaluation of long term reliability of these materials beside the highly precise measurement of their thermal conductivity.

What You Will Learn

  • The importance of the proper selection of thermal interface materials in an electric system
  • The most important properties describing the performance of a TIM materials
  • Benefits and drawbacks of commonly used TIM testing techniques including the ASTM D-5470 standard
  • Some new ways of improvements of the existing TIM testing techniques
  • An in-situ TIM testing solution
  • A possible definition of the failure criteria for the degradation of thermal interface materials

About the Presenter

Presenter Image Andras Vass-Varnai

Andras Vass-Varnai obtained his MSc degree in electrical engineering in 2007 at the Budapest University of Technology and Economics. He is a Product Manager in the MicReD Division at Mentor Graphics. Beside his work he is also a correspondent Ph.D. student at the Technical University of Budapest. His main topics of interest include thermal management of electric systems, advanced applications of thermal transient testing, characterization of TIM materials and high power semiconductor devices.

Who Should Attend

  • TIM manufacturers and end-users
  • System designers of electronic systems
  • Thermal engineers
  • Engineers interested in reliability issues

Technical Requirements

What do I need to watch and hear this web seminar?

Mentor Graphics’ web seminars are delivered using Adobe Connect. You will be able to login to the seminar room 15 minutes prior to the start time on the day of the presentation. You can hear the audio using your computer’s speakers via VoIP (Voice over IP) and background music will play prior to the beginning of the presentation.

Detailed system requirements

Microsoft® Windows

  • Windows XP, Windows Vista, Windows 7, Windows 8
  • Microsoft Internet Explorer 7, 8, 9, 10; Mozilla Firefox; Google Chrome
  • Adobe® Flash® Player 10.3 or later
  • 1.4GHz Intel® Pentium® 4 or faster processor and 512MB of RAM

Mac OS X, 10.5, 10.6, 10.7.4, 10.8

  • Mozilla Firefox; Apple Safari; Google Chrome
  • Adobe Flash Player 10.3
  • 1.83GHz Intel Core™ Duo or faster processor and 512MB of RAM

Linux

  • Ubuntu 10.04, 11.04; Red Hat Enterprise Linux 6; OpenSuSE 11.3
  • Mozilla Firefox
  • Adobe Flash Player 10.3

Mobile

  • Apple supported devices: iPad, iPad2, iPad3; iPhone 4 and 4 S, iPod touch (3rd generation minimum recommended)
  • Apple supported OS versions summary: iOS 4.3.x, 5.x, or 6.x (5.x or higher recommended)
  • Android supported devices: Samsung Galaxy Tab 2 (10.1), Samsung Galaxy Tab (10.1), ASUS Transformer, Samsung Galaxy Tab (7”) , Motorola Xoom, Motorola Xoom 2, Nexus 7
  • Android supported OS versions summary: 2.2 and higher
  • Android AIR Runtime required: 3.2 or higher

Additional requirements

  • Bandwidth: 512Kbps for participants, meeting attendees, and end users of Adobe Connect applications. Connection: DSL/cable (wired connection recommended) for Adobe Connect presenters, administrators, trainers, and event and meeting hosts.

 
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