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Heatsink 101: Everything You Ever Wanted To Know Web Seminar

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Overview

As the power density of electronics devices go up, so does the need for chip and system thermal management. One way to cool the components down is to add a heatsink. heatsinks uses conduction, convection and sometimes radiation to enhance the heat transfer from a hot surface to a cooler fluid. Many factors such as cost, manufacturability and weight need to be considered when choosing a heatsink. How the heatsink gets attached to the component is also critical.

During this 45 minute presentation, we will focus on how heatsinks work and how to design a heatsink while considering all the critical factors such as size, airflow, cost and attachment methods. We will also investigate how, using simulation, the heatsink design could be optimized and validated in the application environment. Engineers involved in board and chassis design would find this session very educational.

What You Will Learn

  • How to design a heatsink for a specific electronics cooling application
  • To visualize the airflow around the heatsink and identify potential bypass areas
  • Estimate heatsink thermal resistance
  • Use Response Surface Optimization to come up with the best heatsink design for the considered environment

About the Presenter

Presenter Image Alexandra Francois-Saint-Cyr

Alexandra Francois-Saint-Cyr is the Applications Engineering Manager for North America at Mentor Graphics, Mechanical Analysis Division (Previously Flomerics). For the past 8 years, she has been working on promoting the use of the Mentor Computational Fluid Dynamics (CFD) software by conducting training classes, seminars and software demonstrations.

After graduating from ESSTIN, France’s State Graduate School of Engineering back in 1997, Alex studied to improve passenger comfort in the trains at Alstom Transport by using CFD software FloVENT. In 1999, she moved to the United States where she received her MSME from the University of Central Florida. There she worked on a meso-scale centrifugal compressor project, her research leading to the ‘Best Technical Paper’ award in the Advanced Energy Systems Division at the International ASME show in 2000

Who Should Attend

  • Engineers who have thermal problems with electronic based applications
  • Technical Managers
  • Thermal Engineers
  • Board and Chassis Engineers

Products Covered

Technical Requirements

What do I need to watch and hear this web seminar?

Mentor Graphics’ web seminars are delivered using Adobe Connect. You will be able to login to the seminar room 15 minutes prior to the start time on the day of the presentation. You can hear the audio using your computer’s speakers via VoIP (Voice over IP) and background music will play prior to the beginning of the presentation.

Detailed system requirements

Microsoft® Windows

  • Windows XP, Windows Vista, Windows 7, Windows 8
  • Microsoft Internet Explorer 7, 8, 9, 10; Mozilla Firefox; Google Chrome
  • Adobe® Flash® Player 10.3 or later
  • 1.4GHz Intel® Pentium® 4 or faster processor and 512MB of RAM

Mac OS X, 10.5, 10.6, 10.7.4, 10.8

  • Mozilla Firefox; Apple Safari; Google Chrome
  • Adobe Flash Player 10.3
  • 1.83GHz Intel Core™ Duo or faster processor and 512MB of RAM

Linux

  • Ubuntu 10.04, 11.04; Red Hat Enterprise Linux 6; OpenSuSE 11.3
  • Mozilla Firefox
  • Adobe Flash Player 10.3

Mobile

  • Apple supported devices: iPad, iPad2, iPad3; iPhone 4 and 4 S, iPod touch (3rd generation minimum recommended)
  • Apple supported OS versions summary: iOS 4.3.x, 5.x, or 6.x (5.x or higher recommended)
  • Android supported devices: Samsung Galaxy Tab 2 (10.1), Samsung Galaxy Tab (10.1), ASUS Transformer, Samsung Galaxy Tab (7”) , Motorola Xoom, Motorola Xoom 2, Nexus 7
  • Android supported OS versions summary: 2.2 and higher
  • Android AIR Runtime required: 3.2 or higher

Additional requirements

  • Bandwidth: 512Kbps for participants, meeting attendees, and end users of Adobe Connect applications. Connection: DSL/cable (wired connection recommended) for Adobe Connect presenters, administrators, trainers, and event and meeting hosts.

 
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