Heatsink 201 - Even More About Heatsink Design
On-demand Web Seminar
In this webinar we will discuss how manufacturer’s data is obtained, and why this may not be applicable for use in design by showing a simple example of how a heatsink interacts locally with the surrounding airflow.
We will illustrate why heatsinks are not as simple to use as they first appear, and why they should be designed for a particular application. We will also talk more about the myths surrounding heatsinks and their application, and give some practical advice concerning heatsink design and attachment. The presentation will conclude by looking at different optimization strategies for heatsink design.
This session is a continuation on from Heatsink 101, during this 45 minute presentation we will dig deeper into how heatsinks work and discuss why they are not as simple as they look. Before you listen to this presentation we suggest you listen to Heatsink 101. Engineers involved in board and chassis design will find the video demonstrating heatsink design optimization using simulation particularly educational.
What You Will Learn
- Why heatsinks are not as easy to use in practice as they first appear
- How to design a heatsink in context, i.e. for a specific electronics cooling application
- How airflow interacts with a heatsink, helping you understand heatsink behavior
- Practical issues in the design and use of heatsinks
- Optimization strategies to achieve the most appropriate heatsink design
About the Presenter
Dr. John Parry, CEng.
John Parry joined Mentor Graphics’ Mechanical Analysis Division (formerly Flomerics) in 1989 as the head of the Customer Services department. After four years, John moved to the Research department and he has been managing the division’s research activities since 1997.
Having published many technical papers over the years, John’s technical contributions include the development of compact thermal models for fans, heat sinks and chip packages. He is also a subject-matter expert in the application of Design of Experiment and optimisation techniques.
John serves on several conference committees. He was the General Chair of SEMI-THERM 21 and currently represents the Mechanical Analysis Division in the JEDEC committee on thermal standards.
Who Should Attend
- Engineers who have thermal problems with electronics-based applications
- CAD, CAE and other Technical Managers with product thermal responsibility
- Thermal Engineers
- Mechanical Engineers
- Mechanical Designers Board and Chassis Designers
What do I need to watch and hear this web seminar?
Mentor Graphics’ web seminars are delivered using Adobe Connect. You will be able to login to the seminar room 15 minutes prior to the start time on the day of the presentation. You can hear the audio using your computer’s speakers via VoIP (Voice over IP) and background music will play prior to the beginning of the presentation.
Detailed system requirements
- Windows XP, Windows Vista, Windows 7, Windows 8
- Microsoft Internet Explorer 7, 8, 9, 10; Mozilla Firefox; Google Chrome
- Adobe® Flash® Player 10.3 or later
- 1.4GHz Intel® Pentium® 4 or faster processor and 512MB of RAM
Mac OS X, 10.5, 10.6, 10.7.4, 10.8
- Mozilla Firefox; Apple Safari; Google Chrome
- Adobe Flash Player 10.3
- 1.83GHz Intel Core™ Duo or faster processor and 512MB of RAM
- Ubuntu 10.04, 11.04; Red Hat Enterprise Linux 6; OpenSuSE 11.3
- Mozilla Firefox
- Adobe Flash Player 10.3
- Apple supported devices: iPad, iPad2, iPad3; iPhone 4 and 4 S, iPod touch (3rd generation minimum recommended)
- Apple supported OS versions summary: iOS 4.3.x, 5.x, or 6.x (5.x or higher recommended)
- Android supported devices: Samsung Galaxy Tab 2 (10.1), Samsung Galaxy Tab (10.1), ASUS Transformer, Samsung Galaxy Tab (7”) , Motorola Xoom, Motorola Xoom 2, Nexus 7
- Android supported OS versions summary: 2.2 and higher
- Android AIR Runtime required: 3.2 or higher
- Bandwidth: 512Kbps for participants, meeting attendees, and end users of Adobe Connect applications. Connection: DSL/cable (wired connection recommended) for Adobe Connect presenters, administrators, trainers, and event and meeting hosts.
Reliability in Networking and Telecom Systems – Managing Excessive Heat
The main source of heat in electronic equipment is their semiconductor chips, and the temperature sensitivities of these chips presents a challenge in designing cooling solutions. Overheating causes the...
12 Key Considerations in Enclosure Thermal Design… A High-Level ‘How To’ Guide
Why is Enclosure Thermal Design Important? Before we look at the 12 key considerations in enclosure thermal design let´s first consider why thermal issues need to be considered at the system, or enclosure...
10 Tips for Streamlining PCB Thermal Design… A High-Level ‘How To’ Guide
Many aspects of a PCB’s performance are determined during detailed design, e.g. making a trace a specific length for timing reasons. Timing issues are also affected by temperature differences between components....