Introduction to Thermal Simulation of Electronics
In this quick 20-minute presentation, we will give you an overview of the how and why of thermal simulation of electronics. We will also give a brief history of how it all started.
Electronic Components and Systems Designers struggling with the thermal design of their products will benefit from this event which will show how the use of Computational Fluid Dynamics (CFD) can improve the efficiency and reliability of their designs and reduce the need for costly prototyping.
What You Will Learn
- Thermal Design Challenges
- What is CFD
- A typical electronic design process using CFD
- Optimizing your design by focusing and refining design aspects
About the Presenters
Richard Ozaki obtained a Master of Engineering degree from University College London after specializing in the CFD analysis of turbomachinery. He works as an EMEA Channel Application Engineer and has been a part of the Mentor Graphics Mechanical Analysis Division since 2005 working in various roles from engineering to sales. Richard specializes in the FloTHERM, FloVENT and FloEFD lines of software products where he regularly conducts training, consultancy and support.
Paul achieved his Mechanical Engineering Degree from The City University in 1987. Paul has spent the last 15 years working for Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) specializing in the application of CFD to the design of the built environment and electronic equipment. Prior to this he worked for the Building Services Research and Information Association (BSRIA) in a role that covered both physically and numerical modeling.
Currently, Paul is a Senior Application Engineer in the engineering team of Mentor’s Mechanical Analysis Division, training and supporting the user base to enhance the accessibility of thermal analysis to the engineering designer. Over these many years he has gained significant experience, not only in the use of software, but also of the general design processes and the best way to apply CFD techniques to real world problems encountered by engineers’ everyday.
Who Should Attend
- Engineers who have thermal problems with electronics-based applications
- CAD, CAE and other Technical Managers with product thermal responsibility
- Thermal Engineers
- Mechanical Engineers
- Mechanical Designers Board and Chassis Designers
What do I need to watch and hear this web seminar?
Mentor Graphics’ web seminars are delivered using Adobe Connect. You will be able to login to the seminar room 15 minutes prior to the start time on the day of the presentation. You can hear the audio using your computer’s speakers via VoIP (Voice over IP) and background music will play prior to the beginning of the presentation.
Detailed system requirements
- Windows XP, Windows Vista, Windows 7, Windows 8
- Microsoft Internet Explorer 7, 8, 9, 10; Mozilla Firefox; Google Chrome
- Adobe® Flash® Player 10.3 or later
- 1.4GHz Intel® Pentium® 4 or faster processor and 512MB of RAM
Mac OS X, 10.5, 10.6, 10.7.4, 10.8
- Mozilla Firefox; Apple Safari; Google Chrome
- Adobe Flash Player 10.3
- 1.83GHz Intel Core™ Duo or faster processor and 512MB of RAM
- Ubuntu 10.04, 11.04; Red Hat Enterprise Linux 6; OpenSuSE 11.3
- Mozilla Firefox
- Adobe Flash Player 10.3
- Apple supported devices: iPad, iPad2, iPad3; iPhone 4 and 4 S, iPod touch (3rd generation minimum recommended)
- Apple supported OS versions summary: iOS 4.3.x, 5.x, or 6.x (5.x or higher recommended)
- Android supported devices: Samsung Galaxy Tab 2 (10.1), Samsung Galaxy Tab (10.1), ASUS Transformer, Samsung Galaxy Tab (7”) , Motorola Xoom, Motorola Xoom 2, Nexus 7
- Android supported OS versions summary: 2.2 and higher
- Android AIR Runtime required: 3.2 or higher
- Bandwidth: 512Kbps for participants, meeting attendees, and end users of Adobe Connect applications. Connection: DSL/cable (wired connection recommended) for Adobe Connect presenters, administrators, trainers, and event and meeting hosts.