Long Term Reliability in Electronic Systems
On-demand Web Seminar
The webinar will give an introduction to thermally induced failure mechanisms within the package region of the chip and also outside at the cooling structures.
An overview will be given how failures such as die attach delamination, cracks, grease pump-out, etc. develop due to high temperature and temperature cycling. It will be explained in details how the cooling path from the junction of a semiconductor towards the ambient can be characterized, to make sure that the chip temperature does not reach critical levels.
In the second section of the presentation I will introduce standard reliability test methods to verify the long term behavior of a packaged device, or even a whole electric system. A special emphasize will be put on role of TIM (Thermal Interface Material) materials in the long term reliability of power semiconductors. Ideas and examples will be given, how the so-called structure functions can be applied to define a failure criteria which makes it possible to decide whether the tested system would work reliably on the long run or not.
Short cases studies will be shown on the possible reliability test methods of LEDs and thermal interface materials.
What You Will Learn
- The effect of bad thermal management on the lifetime of an electrical system
- Overview of temperature induced failure mechanisms in electrical systems
- Transient and steady-state thermal characterization of electric assemblies
- Overview will be given on accelerated reliability tests
- A possible definition of the failure criteria for the degradation of thermal interface materials
- A structure-function based evaluation of die attach failures
About the Presenter
Andras Vass-Varnai obtained his MSc degree in electrical engineering in 2007 at the Budapest University of Technology and Economics. He is a Product Manager in the MicReD Division at Mentor Graphics. Beside his work he is also a correspondent Ph.D. student at the Technical University of Budapest. His main topics of interest include thermal management of electric systems, advanced applications of thermal transient testing, characterization of TIM materials and high power semiconductor devices.
Who Should Attend
- Engineers interested in reliability issues
- System designers of electronic systems with high power density
- Thermal engineers
- TIM manufacturers and end-users
What do I need to watch and hear this web seminar?
Mentor Graphics’ web seminars are delivered using Adobe Connect. You will be able to login to the seminar room 15 minutes prior to the start time on the day of the presentation. You can hear the audio using your computer’s speakers via VoIP (Voice over IP) and background music will play prior to the beginning of the presentation.
Detailed system requirements
- Windows XP, Windows Vista, Windows 7, Windows 8
- Microsoft Internet Explorer 7, 8, 9, 10; Mozilla Firefox; Google Chrome
- Adobe® Flash® Player 10.3 or later
- 1.4GHz Intel® Pentium® 4 or faster processor and 512MB of RAM
Mac OS X, 10.5, 10.6, 10.7.4, 10.8
- Mozilla Firefox; Apple Safari; Google Chrome
- Adobe Flash Player 10.3
- 1.83GHz Intel Core™ Duo or faster processor and 512MB of RAM
- Ubuntu 10.04, 11.04; Red Hat Enterprise Linux 6; OpenSuSE 11.3
- Mozilla Firefox
- Adobe Flash Player 10.3
- Apple supported devices: iPad, iPad2, iPad3; iPhone 4 and 4 S, iPod touch (3rd generation minimum recommended)
- Apple supported OS versions summary: iOS 4.3.x, 5.x, or 6.x (5.x or higher recommended)
- Android supported devices: Samsung Galaxy Tab 2 (10.1), Samsung Galaxy Tab (10.1), ASUS Transformer, Samsung Galaxy Tab (7”) , Motorola Xoom, Motorola Xoom 2, Nexus 7
- Android supported OS versions summary: 2.2 and higher
- Android AIR Runtime required: 3.2 or higher
- Bandwidth: 512Kbps for participants, meeting attendees, and end users of Adobe Connect applications. Connection: DSL/cable (wired connection recommended) for Adobe Connect presenters, administrators, trainers, and event and meeting hosts.