Long Term Reliability in Electronic Systems

There are currently no dates scheduled for this event. However a recording of a previous session is available as an on-demand web seminar.

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Overview

The webinar will give an introduction to thermally induced failure mechanisms within the package region of the chip and also outside at the cooling structures.

An overview will be given how failures such as die attach delamination, cracks, grease pump-out, etc. develop due to high temperature and temperature cycling. It will be explained in details how the cooling path from the junction of a semiconductor towards the ambient can be characterized, to make sure that the chip temperature does not reach critical levels.

In the second section of the presentation I will introduce standard reliability test methods to verify the long term behavior of a packaged device, or even a whole electric system. A special emphasize will be put on role of TIM (Thermal Interface Material) materials in the long term reliability of power semiconductors. Ideas and examples will be given, how the so-called structure functions can be applied to define a failure criteria which makes it possible to decide whether the tested system would work reliably on the long run or not.

Short cases studies will be shown on the possible reliability test methods of LEDs and thermal interface materials.

What You Will Learn

• The effect of bad thermal management on the lifetime of an electrical system
• Overview of temperature induced failure mechanisms in electrical systems
• Transient and steady-state thermal characterization of electric assemblies
• Overview will be given on accelerated reliability tests
• A possible definition of the failure criteria for the degradation of thermal interface materials
• A structure-function based evaluation of die attach failures