Understanding Thermal Challenges in Electronics: Component and Thermal Interface Material (TIM) Characterization

Seminar
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Overview

T3Ster - Thermal Transient Tester

Spend the day with us learning about our measurement system for the fast and very accurate thermal characterization of electronic components and systems (IC packages, MOSFETS, IGBTs, etc.)

You will also experience hands-on practical exercises with the T3Ster Measurement System.

What You Will Learn

  • Basics of the system and the measurement methodology
  • Basic T3Ster and Modules for diverse application areas - typical configurations
  • Use in practice within the electronic industry, application examples (LEDs, IGBTs, TIMs, etc.)
  • Rth/Zth, structure functions as well as reliability of High Power Electronics
  • Interfacing CFD simulation – thermal analysis concept in completion
  • New member of the product family: The DynTIM – the thermal interface material tester (Concept and test measurements)

About the Presenter

Presenter Image Andras Vass-Varnai

Andras Vass-Varnai obtained his MSc degree in electrical engineering in 2007 at the Budapest University of Technology and Economics. He works as a technical marketing engineer at the MicReD Division at Mentor Graphics since. Beside his work he is also a correspondent Ph.D. student at the Technical University of Budapest. His main topics of interest include thermal management of electric systems, advanced applications of thermal transient testing, characterization of TIM materials and high power semiconductor devices.

Who Should Attend

  • Electronic engineers, physicists, measurement engineers, project managers and laboratory engineers
  • Material engineers, Mechanical engineers, appliance manufacturing engineers, assembly engineers, process engineers, chemical engineers, reliability and quality engineers
  • Those who are in charge of ensuring the reliability of electronic components like Chips, IGBTs, MOSFETs, (high power) LEDs as well as LED-chains
  • Those involved in semiconductors, automotive electronics, systems, LED technology and chemical

 

Products Covered

Agenda

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