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Thermal Characterization Introduction



This technical seminar explores thermal measurement methods and standards for assessing semi-conductor components material quality, device reliability and thermal performance.

Thermal Characterization can be used to determine correct device packaging in development, to verify thermal resistance values, and for failure analysis in applications from packaged ICs through to LED lighting and High Power Electronics devices.

This 2.5 hour session includes live testing demonstrations and focuses on capabilities with Mentor Graphics T3Ster, transient thermal test equipment product family. Places are limited – register now.

What You Will Learn

  1. Introduction to thermal characterization and measurement applications for assessing:
    • Quality – e.g deriving IC Package internal resistances and capacitances along the heat flow path to identify structural deviation
    • Performance – accurate, repeatable junction temperature measurement and RthJc calculation
    • Reliability – e.g power cycling studies in conjunction with thermal characterization
    • LED lighting applications
    • Thermal Interface TIM material thermal Characterization
  2. Important standards (incl. JEDEC JESD STD 51-14)  discussion and equipment set up and post processing calculations:
    • Using T3Ster to determine junction-to-case thermal resistance (RthJC )
    • Understanding the “structure function” derived from post processing transient thermal measurement and what it can indicate
  3. Demonstration: 1-3 examples will be tested live to illustrate test methods to determine Junction Temperature, Junction-to-case thermal resistance and other studies.
  4. Using Measured Data in electronics cooling simulation ( via FloTHERM software) for accurate validated compact thermal models
  5. Implementing T3Ster successfully – a few examples from lighting, power electronics (incl. IGBTs, MOSFETS), Thermal Interface Material (TIM) Characterization to IC component level testing

Who Should Attend

  • Electronics thermal test engineers
  • Reliability & quality engineers
  • Materials scientists & engineers
  • Power electronics component test engineers
  • Research scientists
  • IC test technician/lab managers
  • Package design engineers
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