Thermal Characterization of Electronic Components & Systems
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Jun 19, 2012
Hampton Court, Surrey, UK 9:45 AM - 4:30 PM Europe/London |
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Jun 27, 2012
Stuttgart, Germany 9:45 AM - 5:15 PM Europe/Berlin |
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Overview
Information Day - System Level Thermal Testing - Measurement Methodology
T3Ster - Thermal Transient Tester
Spend the day with us learning about our measurement system for the fast and very accurate thermal characterization of electronic components and systems (IC packages, MOSFETS, IGBTs, etc.)
You will also experience hands-on practical exercises with the T3Ster Measurement System.
What You Will Learn
- Basics of the system and the measurement methodology
- Basic T3Ster and Modules for diverse application areas - typical configurations
- Use in practice within the electronic industry, application examples (LEDs, IGBTs, TIMs, etc.)
- Rth/Zth, structure functions as well as realiability of High Power Electronics
- Interfacing CFD simulation – thermal analysis concept in completion
About the Presenter
Andras Vass-Varnai
Andras Vass-Varnai obtained his MSc degree in electrical engineering in 2007 at the Budapest University of Technology and Economics. He works as a technical marketing engineer at the MicReD Division at Mentor Graphics since. Beside his work he is also a correspondent Ph.D. student at the Technical University of Budapest. His main topics of interest include thermal management of electric systems, advanced applications of thermal transient testing, characterization of TIM materials and high power semiconductor devices.
Who Should Attend
- Electronic engineers, physicians, measurement engineers, project managers and laboratory engineers
- Those who are in charge of ensuring the realiability of electronic components like Chips, IGBTs, MOSFETs, (high power) LEDs as well as LED-chains
- Those involved in semiconductors, automotive electronics, systems, LED technology
Products Covered
Agenda
Germany
UK
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