JEDEC standards for a number of thermal metrics are now available for monochip packages – including θ (JA, JC, JMA and JB) and Ψ(JT and JB) parameters, all of which require the package of interest to be exercised in one of several standard test environments – a manually intensive and laborious process. With FloTHERM IC packaging engineers can generate the full spectrum of JEDEC metrics and compact models for a package under one roof, plus support for JEDEC 2-Resistor and DELPHI compact models.
SmartParts & Libraries
Key package sub-elements can be represented as libraries, and saved and imported from independent vendors. Package constituents such as die, die attach, die attach pad, substrate, leadframe, lid, etc., can be stored as separate library items, thus greatly speeding new package creation. The range of supported packages is continuously updated to capture rapid advances in packaging technology, (e.g. System-in-Package (SiP) and stacked die).