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FloTHERM Products


Automated, simulation-based IC package thermal characterization

Industries and Applications

FloTHERM® PACK is a unique web-based solution designed to generate reliable, accurate thermal models for FloTHERM with minimum effort, 20 times faster than conventional approaches. It supports model generation for IC components, test boards, standard test harnesses and other associated parts.


In the electronics industry, FloTHERM PACK is used to support the supply chain, with semiconductor companies and packaing houses using FloTHERM PACK to create 2-Resistor, DELPHI and detailed thermal models of their parts to support their customers.

PCB designers, contract manufacturers, and systems integrators use these models in FloTHERM, FloTHERM XT and FloTHERM PCB to predict accurate component temperatures during design. This ensures that product reliability is achieved at minimal cost. Key features include:

  • Wide range of package styles supported
  • Worksheets allow package models to be built directly from the key design data
  • Customization of detailed models in FloTHERM allows total flexibility over the package design before compact model creation
  • JEDEC compliant 2-Resistor and DELPHI compact model creation

IDT is simulating new packaging configuration with FloTHERM software from the Mentor Graphics Corp. Mechanical Analysis Division Integrated Device Technology (IDT)

“Since we have begun simulating every new packaging configuration, we have never had to make a late-stage design change nor has any product been delayed for thermal performance reasons.”

Jitesh Shah, IDT

Integrated Device Technology (IDT)
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