FloTHERM uses advanced CFD techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems including racks and data centers. It features the industry's best solution for integration with MCAD and EDA software.
Intelligent Thermal Models
Models ranging in scale from single ICs on a PCB to full racks of electronics can be quickly assembled from a complete set of SmartParts (intelligent model creation macros) that are supplied with FloTHERM. Sourced from suppliers world-wide, SmartParts capture modeling expertise to streamline model creation, minimizing solve times and maximizing solution accuracy.
Thermo Electric Cooler (TEC) SmartPart functionality is also supported by FloTHERM. By adding a TEC you can control the temperature so the specified component doesn’t get hotter than the predefined maximum for your design.
The Fan RPM derating feature supports the operation of an electronic device at less than its rated maximum power while taking into consideration the case or body temperature, ambient temperature and the type of cooling mechanism used.
MCAD and EDA Integration
FloTHERM offers unprecedented integration with MCAD and EDA software. Using the FloMCAD Bridge module, engineers can import native data from Creo, SolidWorks, CATIA and other MCAD and EDA software into FloTHERM. Unlike other thermal analysis software, FloTHERM automatically prepares the geometry for efficient and accurate analysis.
FloTHERM can import IDF format files for EDA interfacing, as well as direct interfaces to Expedition PCB, BoardStation, Allegro and CR5000.
Robust Structured Cartesian Mesher
The FloTHERM grid is based on a structured-Cartesian method, the most stable and numerically efficient type of grid available. Engineers can localize the grid for finer resolution where needed, minimizing solution time and improving accuracy in grid quality.
A FloTHERM grid is associated with SmartParts, generated as part of the model assembly process, giving the user control over refinement and enabling engineers to focus on design rather than analysis. Where other tools require significant time and expertise to master gridding, FloTHERM gridding is instantaneous and reliable. And FloTHERM is the only analysis software with object-associated grid, eliminating re-gridding for each model modification.
SmartPart-based modeling and a structured Cartesian grid enable “automatic sequential optimization,” unique to FloTHERM. The feature lets users specify a design goal, then let FloTHERM do the hard work of finding the right combination of design variables to meet that goal.
This feature can be used to optimize heatsink design, PCB component placement, fan/blower selection and other common design scenarios. It also enables finding otherwise-impractical design margin or production cost savings.
Alternatively, users can construct a design of experiments (DoE) that automatically analyzes the full range of all possible combinations of parametric variations. These models can be solved on a distributed network of computers using the unique “Volunteer” solution technology.
The FloTHERM solver has specifically addressed electronics cooling applications for more than 25 years, delivering the most accurate results possible, and the fastest solution time per grid cell. It resolves massive disparity in geometric length scales using the unique ‘localized-grid’ technique, which allows for integrally matched, nested, non-conformal grid interfaces between different parts of the solution domain.
The conjugate nature of heat transfer within electronic systems is concurrently solved using a preconditioned conjugate residual solver together with a flexible cycle multi-grid solution technique. Pragmatic, unique and accurate solution termination criteria produce useful results in engineering, not academic, time scales, with good scaling up to 32 cores for multi-core hardware.
Powerful Visualization Tools
The FloTHERM visualization toolset maximizes productivity when sharing the results of your design and analysis of electronics cooling projects. Fully rendered models, 3D flow animation and tools for dynamic manipulation of temperature, as well as flow results, enable engineers to pinpoint thermal issues and visualize design improvements quickly and effectively.
Texture mapping and AVI output enable communication of thermal-design concepts with non-technical colleagues. Thermal Bottleneck (BN) and Shortcut (SC) post-processing parameters let engineers visualize existing thermal bottlenecks and any opportunities to insert a new heat flow path in order to shortcut the heat to cooler areas.
The FloVIZ viewer, a complimentary, fully-functional version of the post-processor, can be used for easy “off-site” results presentation.
Extensive Usability Features
We're continually making FloTHERM better at what it does today. For example, we've added integrated model checking support in the Project Manager and Drawing Board, allowing users to see what objects have a material attached, the power attached to every object and the corresponding assembly-level power dissipation, and whether the object is creating a mesh line.