IEEE Conference Papers
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Papers
2006
Twenty-Second Annual Semiconductor Thermal Measurement and Management Symposium, 14-16 March 2006
- Multi-domain simulation and measurement of power LED-s and power LED assemblies
Vladimír Székely, György Horváth, Department of Electron Devices, Budapest University of Technology & Economics, Hungary
András Poppe , Gábor Farkas, Márta Rencz, MicReD Ltd., Hungary
2005
Twenty-First Annual Semiconductor Thermal Measurement and Management Symposium, 15-17 March 2005
- Thermal transient characterization methodology for single-chip and stacked structures
Péter Szabó, Gábor Farkas, MicReD Ltd., Hungary
Oliver Steffens, Infineon Technologies AG, Regensburg, Germany
Michael Lenz, Infineon Technologies AG, München, Germany - Thermal issues in stacked die packages
Marta Rencz MicReD Ltd, Hungary and Budapest University of Technology and Economics, Department of Electron Devices, Hungary
Components and Packaging Technologies, IEEE Transactions Volume 32, Issue 2:
- Thermal Measurement and Modeling of Multi-Die Packages
András Poppe, Márta Rencz, Vladimír Székely, Budapest University of Technology, Department of Electron Devices, Hungary
Gábor Farkas, Péter Szabó, MicReD Ltd, Hungary
Yan Zhang, John Wilson, Flomerics Inc., USA
John Parry, Flomerics Ltd., UK
2004
Twentieth Annual Semiconductor Thermal Measurement and Management Symposium, 9-11 March 2004:
- Electric and thermal transient effects in high power optical devices
Gábor Farkas, András Poppe, MicReD Ltd., Hungary
Haque, Frank Wall, Paul S. Martin, Lumileds Lighting, USA
György Bognár, Budapest Univ. of Technology & Economics, Hungary
Quint van Voorst Vader, Lumileds Lighting B.V., The Netherlands - A procedure to correct the error in the structure function based thermal measuring methods
M. Rencz, A. Poppe, MicReD Ltd., Budapest, Hungary E. Kollár, S. Ress, V. Székely, BUTE, Department of Electron Devices, Budapest, HungaryB.Courtois, TIMA Laboratory, Grenoble, France - Structure function evaluation of stacked dies
Marta Rencz, MicReD Ltd, Hungary
Vladimir Székely, Budapest University of Technology and Economics, Hungary
Proceedings of The 9th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'04), 1-4 June 2004
- Increasing the accuracy of structure function based evaluation of thermal transient measurements
M. Rencz, A. Poppe, MicReD Ltd
E. Kollár, S. Ress, V. Székely, Budapest University of Technology & Economics, Department of Electron Devices, Hungary
B. Courtois, TIMA Laboratory, Grenoble, France
Proceedings of 6th Electronics Packaging Technology Conference (EPTC'04), 8-10 December 2004
- Thermal Qualification of 3D Stacked die Packages
M. Rencz, G. Farkas, MicReD Ltd, Hungary
V. Székely, A. Poppe, BUTE, Budapest, Hungary
B. Courtois, TIMA Laboratoire, Grenoble, Franc
2003
Nineteenth Annual Semiconductor Thermal Measurement and Management Symposium, 11-13 March 2003:
- Dynamic compact models of cooling mounts for fast board level design
G. Farkas, A. Poppe, MicReD Ltd., Hungary
E. Kollar, Budapest University of Technology & Economics, Hungary
P. Stehouwer, Centre for Quantitative Methods CQM BV, The Netherlands - Non-linearity issues in the dynamic compact model generation
Marta Rencz, MicReD Ltd, Hungary
Vladimir Székely, Budapest University of Technology and Economics, Hungary
Proceedings of the 28th IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (IEMT'03), 16-18 July 2003
- A Methodology for the Generation of Dynamic Compact Models of Packages and Heat Sinks From Thermal Transient Measurements
M. Rencz, G. Farkas, A. Poppe, MicReD Ltd, Hungary
V. Székely, BUTE, Budapest, Hungary
B. Courtois, TlMA Laboratoire, Grenoble, France
Proceedings of the 9th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'03), 24-26 September 2003
- Evaluation Issues of Thermal Measurements Based on the Structure Functions
M. Rencz, A. Poppe, MicReD Ltd, Hungary
E. Kollár, S. Ress, A. Poppe, BUTE, Department of Electron Devices, Budapest, Hungary - Thermal Investigation of High Power Optical Devices by Transient Testing
Gábor Farkas, András Poppe, MicReD Ltd, Hungary
Quint van Voorst Vader, Lumileds Lighting B.V., The Netherlands
Gábor Farkas, András Poppe, György Bognár, BUTE, Department of Electron Devices, Budapest, Hungary
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC'03), 10-12 December 2003
- Boundary condition independent dynamic compact models of packages and heat sinks from thermal transient measurements
M. Rencz, G. Farkas, A. Poppe, MicReD, Hungary
V. Székely, A. Poppe, BUTE, Budapest, Hungary
B. Courtois, TIMA Laboratoire, Grenoble, France