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IEEE Conference Papers

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Papers

2006

Twenty-Second Annual Semiconductor Thermal Measurement and Management Symposium, 14-16 March 2006

2005

Twenty-First Annual Semiconductor Thermal Measurement and Management Symposium, 15-17 March 2005

Components and Packaging Technologies, IEEE Transactions Volume 32, Issue 2:

  • Thermal Measurement and Modeling of Multi-Die Packages
    András Poppe, Márta Rencz, Vladimír Székely, Budapest University of Technology, Department of Electron Devices, Hungary
    Gábor Farkas, Péter Szabó, MicReD Ltd, Hungary
    Yan Zhang, John Wilson, Flomerics Inc., USA
    John Parry, Flomerics Ltd., UK

2004

Twentieth Annual Semiconductor Thermal Measurement and Management Symposium, 9-11 March 2004:

Proceedings of The 9th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'04), 1-4 June 2004

Proceedings of 6th Electronics Packaging Technology Conference (EPTC'04), 8-10 December 2004

2003

Nineteenth Annual Semiconductor Thermal Measurement and Management Symposium, 11-13 March 2003:

Proceedings of the 28th IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (IEMT'03), 16-18 July 2003

Proceedings of the 9th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'03), 24-26 September 2003

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC'03), 10-12 December 2003

 
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