Mentor’s thermal design solutions reduce overall design time, reduce late-design rework, reduce time-to-market, increase reliability, and reduce the final cost of electronics products.
Chip packaging to data center cooling
Since the early 90s, we have led industry research and development in electronic thermal design, through development of physical models of fans, heat sinks, chip packages and many more components that influence thermal design. A strong proponent of open standards, we have supported standardization through our involvement in the JEDEC thermal subcommittee for two decades.
Our electronics thermal design and airflow simulation software solves most design problems associated with cooling for electronics, including IC package and heatsink design, thermal design of printed circuit boards, and selecting the correct cooling fans.
A recent survey by Aberdeen Research found that our customers achieve thermal design verification 3 times faster than others, and are 5 times less likely to need design "re-spins."
In use by 75 of the top 100 electronics companies in the world, FloTHERM® is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment,... FloTHERM®
FloTHERM XT is an industry unique thermal simulation solution designed to be used during all stages of the electronics design process – from conceptual design to manufacturing, improving product quality,... FloTHERM® XT
Embedded into major MCAD systems Concurrent CFD software FloEFD is a full-featured 3D fluid flow and heat transfer analysis package to help Design Engineers optimize product design and speed up their workflow.... FloEFD™
FloVENT® is a powerful Computational Fluid Dynamics (CFD) software that predicts 3D airflow, heat transfer, contamination distribution and comfort indices in and around buildings of all types and sizes;... FloVENT®
MicReD’s flagship product, T3Ster®, is an advanced transient temperature measurement system which enables rapid and extremely accurate thermal characterization of semiconductor device packages... T3Ster
T3Ster® TeraLED® is a specialist solution for obtaining highly accurate measurements for power LEDs. It offers combined thermal and radiometric/photometric characterization of high-power LEDs, either in... T3Ster TeraLED
Flow streamlines and surface plot showing temperature distribution
Smaller is better – at least that seems to be the adage of choice as far as electronics are concerned. From mobile phones to computers and MP3 players, electronics cooling has become a major issue for manufacturers. As products become more feature laden, more components are placed in smaller enclosures leaving less room for cooling airflow. Therefore, manufactures have turned to FloEFD to help them identify and solve electronics cooling problems.
Velocity flow streamlines
Recently a design engineer needed to improve the efficiency of this electronics enclosure. He used FloEFD to calculate the temperature distribution and visualize the airflow. Preparing the model for analysis was very easy with FloEFD. Unlike traditional CFD programs that require users to create additional solid parts to represent the fluid (empty) regions, FloEFD automatically differentiates between the two for internal and external flows and automatically represents the fluid domain. As a result, engineers are freed from the tedium of creating unnecessary geometry just to prepare a solid model for analysis.
“We use FloTHERM as our CFD analysis tool because FloTHERM is well-structured and easy to use compared to other CFD tools, and Flomerics provides the best technical support. The support team is very knowledgeable and responses are always well coordinated.”
Shailesh Joshi, Thermal Analyst, Hewlett-Packard