Power electronics is an enabling technology for creating a low-carbon future, enabling energy-efficient conversion and control solutions for a wide variety of electronics, energy and transportation applications. Innovation in devices, component integration, converters and drives is supporting the development of Integrated Power Electronics Modules (IPEM) across a range of industry sectors.
Wide band gap devices such as SiC and GaN offer the advantage of operating at higher switching frequencies and temperature. However, the available packaging technologies, passives and peripheral components, bonding materials, reliability consideration and cost presently limit the junction temperatures to ~175C.
Mentor’s thermal design software and industry-leading device characterization hardware support the design and deployment of power electronics components, including IGBTs, MOSFETs, HEMP across all industry sectors.
Industry-leading CFD for electronics cooling applications. Learn more
CAD-centric thermal simulation solution for engineers. Learn more
Thermal characterization of semicondutor devices packages and LEDs. Learn more
Test reliability of power electronic components Learn more
Cutting-edge solution for measuring thermal performance of thermal interface materials (TIM). Learn more