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Semiconductors

Image courtesy of IDT

For the semiconductor industry, each technology node presents new challenges in IC design and manufacture. Efficient heat removal from die in MCP/MCMs, stacked-die packages, 3D ICs, is critical and a limiting factor in the miniaturization of package geometries that support ever-more advanced mobile and Consumer Electronics applications. Thinner die result in greater on-die temperature variation, and in the case of multi-die products, greater die-die thermal interaction, such that IC design flows now need to be ‘temperature aware’. LEDs present a unique challenge in terms of their thermal design and opto-thermal characterization.

Mentor’s thermal design software and industry-leading device characterization hardware support the design and characterization all packaged ICs, the creation of detailed and compact thermal models, and the generation of thermal metrics.

Applications

Enclosure-level

At the enclosure level, typical applications include:

PCB-level

At the PCB level, simulation software can assist with:

Testing

For testing purposes, use Mentor Graphics solutions for:

Products

FloTHERM

Industry-leading CFD for electronics cooling applications. Learn more

FloTHERM XT

CAD-centric thermal simulation solution for engineers. Learn more

FloTHERM PACK

Web-based solution for generating thermal models of IC components, test boards and standard test harnesses. Learn more

FloTHERM IC

Web-based tool that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Learn more

T3Ster

Thermal characterization of semicondutor devices packages and LEDs. Learn more

DynTIM

Cutting-edge solution for measuring thermal performance of thermal interface materials (TIM). Learn more

Power Tester 1500A

Test reliability of power electronic components Learn more

 
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