For the semiconductor industry, each technology node presents new challenges in IC design and manufacture. Efficient heat removal from die in MCP/MCMs, stacked-die packages, 3D ICs, is critical and a limiting factor in the miniaturization of package geometries that support ever-more advanced mobile and Consumer Electronics applications. Thinner die result in greater on-die temperature variation, and in the case of multi-die products, greater die-die thermal interaction, such that IC design flows now need to be ‘temperature aware’. LEDs present a unique challenge in terms of their thermal design and opto-thermal characterization.
Mentor’s thermal design software and industry-leading device characterization hardware support the design and characterization all packaged ICs, the creation of detailed and compact thermal models, and the generation of thermal metrics.
Industry-leading CFD for electronics cooling applications. Learn more
CAD-centric thermal simulation solution for engineers. Learn more
Web-based solution for generating thermal models of IC components, test boards and standard test harnesses. Learn more
Web-based tool that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Learn more
Thermal characterization of semicondutor devices packages and LEDs. Learn more
Cutting-edge solution for measuring thermal performance of thermal interface materials (TIM). Learn more
Test reliability of power electronic components Learn more