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Image courtesy of IDT

For the semiconductor industry, each technology node presents new challenges in IC design and manufacture. Efficient heat removal from die in MCP/MCMs, stacked-die packages, 3D ICs, is critical and a limiting factor in the miniaturization of package geometries that support ever-more advanced mobile and Consumer Electronics applications. Thinner die result in greater on-die temperature variation, and in the case of multi-die products, greater die-die thermal interaction, such that IC design flows now need to be ‘temperature aware’. LEDs present a unique challenge in terms of their thermal design and opto-thermal characterization.

Mentor’s thermal design software and industry-leading device characterization hardware support the design and characterization all packaged ICs, the creation of detailed and compact thermal models, and the generation of thermal metrics.



At the enclosure level, typical applications include:


At the PCB level, simulation software can assist with:


For testing purposes, use Mentor Graphics solutions for:


Industry-leading CFD for electronics cooling applications. Learn more

CAD-centric thermal simulation solution for engineers. Learn more

Web-based solution for generating thermal models of IC components, test boards and standard test harnesses. Learn more

Web-based tool that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Learn more

Thermal characterization of semicondutor devices packages and LEDs. Learn more

Cutting-edge solution for measuring thermal performance of thermal interface materials (TIM). Learn more

Test reliability of power electronic components Learn more

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