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Telecoms & Networks

Image courtesy of Cambridge Broadband

Continually increasing computing requirements and network traffic are increasing power densities in enclosures and on boards, require ever-more sophisticated system-level thermal designs to postpone the need for liquid cooling solutions at rack and server level.

Mentor’s thermal design software and industry-leading device characterization hardware support the design of components, PCBs, switches, bridges, and racks.

Applications

Products

Industry-leading CFD for electronics cooling applications. Learn more

Web-based solution for generating thermal models of IC components, test boards and standard test harnesses. Learn more

Web-based solution for generating thermal models of IC components, test boards and standard test harnesses. Learn more

Test reliability of power electronic components Learn more

 
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