Mentor Graphics is the recognized world leader in thermal simulation, testing and characterization of semiconductor devices and IC packages. We have played a leading role in a series of research projects over the last fifteen years that have led to the emergence of global standards in thermal semiconductor modeling and testing of IC chips and packages.
Eliminate Thermal Issues
Semiconductor manufacturers use Mentor software to perform 3D semiconductor heat flux analysis before committing to a design, thus eliminating thermal problems before they occur and saving precious time and resources. This enhances the quality and reliability of the package and reduces the risk of modeling errors.
Mentor Graphics products provide a complete solution for thermal design, analysis and characterization from chip/package/heatsink to circuit scale analysis. We also provide validated thermal models for supply to system builders.
System-in-Package Technologies - The Need for DfX
On-demand Web Seminar The challenges of combining digital, analogue and RF functions into a single piece of silicon and optimising this for different process technologies has proved difficult and extremely costly. Despite major...
FloTHERM® is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation.
FloTHERM XT is an industry unique thermal simulation solution designed to be used during all stages of the electronics design process – from conceptual design to manufacturing, improving product quality, reliability and time-to-market.
FloTHERM PACK automates the creation of simulation-based semiconductor packages, thermal characterization, and the key tasks in semiconductor package design.
FloTHERM® IC is a web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design.
Award winning FloEFD. Embedded into major MCAD systems, FloEFD is a full-featured 3D fluid flow and heat transfer analysis simulation tool to help Design Engineers optimize product design and speed up their workflow. Better products, faster.
MicReD’s flagship product, T3Ster®, is an advanced transient temperature measurement system which enables rapid and extremely accurate thermal characterization of semiconductor device packages or even complete electronic systems. A scalable solution, it offers the best price/performance ratio in the market.
Flow streamlines and surface plot showing temperature distribution
Smaller is better – at least that seems to be the adage of choice as far as electronics are concerned. From mobile phones to computers and MP3 players, electronics cooling has become a major issue for manufacturers. As products become more feature laden, more components are placed in smaller enclosures leaving less room for cooling airflow. Therefore, manufactures have turned to FloEFD to help them identify and solve electronics cooling problems.
Velocity flow streamlines
Recently a design engineer needed to improve the efficiency of this electronics enclosure. He used FloEFD to calculate the temperature distribution and visualize the airflow. Preparing the model for analysis was very easy with FloEFD. Unlike traditional CFD programs that require users to create additional solid parts to represent the fluid (empty) regions, FloEFD automatically differentiates between the two for internal and external flows and automatically represents the fluid domain. As a result, engineers are freed from the tedium of creating unnecessary geometry just to prepare a solid model for analysis.
Learn more about Mentor Graphics' Mechanical Analysis solutions.