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MicReD Product Suite

DynTIM

Dynamic thermal characterization of Thermal Interface Materials (TIM)

Industries and Applications

In all electronic systems thermal management is the main concern and with thermally critical components in contact with heatsinks, housings or PCBs, thermal resistance of that contact is the key factor in the heatflow path. Thermal Interface Materials (TIM) used in such contacts is supposed to improve thermal contact between those components and knowing the exact thermal resistance of a TIM is important for proper thermal management in a system.

TIM materials are major contributors to the thermal budget of a system so their proper selection may be the key to a successful design regardless of the industry. The DynTIM thermal interface material tester has been designed to provide an industrial method to identify thermal conductivity of a relatively wide class of TIMs. This set of tools is ideal for TIM vendors and system manufacturers where due to the application of power semiconductor devices such as power MOSFETs, IGBTs or power LEDs there is high demand for application of high performance, reliable thermal interface materials.

T3Ster Thermal Transient Tester Helps Osram Design and Manufacture Better High-Performance Light-Emitting Diodes (LEDs) Osram Opto Semiconductors GmbH

Aerospace & Defense

Failing die-attach or unreliable thermal interface materials represent high risk on aircraft or in space vehicles – where harsh environmental conditions are present. DynTIM thermal interface material tester provides a robust industrial technique to measure thermal conductivity of TIM materials. The structure function methodology helps locate the contribution of the TIM tested to the total thermal thermal resistance of the measurement setup – similar to how real life in-situ testing of a power semiconductor device is performed.

DynTIM is an extension of the well-proven T3Ster technology – a unique combination of thermal transient measurements with the classical ASTM TIM testing principles. This combination also allows the identification of the bulk of thermal conductivity coefficients for TIMs, and even longterm measurements providing information about their possible degradations.

  • Automated test method, providing the benefits of thermal transient testing combined with the principles of classical TIM testing methods
  • Quasi in-situ material property testing of different kinds of TIM materials
  • Measured TIM thermal conductivity propagated towards our CFD simulation tools such as FloTHERM
Thermal resistance changes due to changes of TIM performance during power cycling

Automotive & Transport

Today’s modern cars are full of electronics – with some of the electrical modules being operated under harsh environmental conditions such as fuel injection. Electric vehicles also use lots of power semiconductor devices such as IGBTs exposed to high dissipation. Each power semiconductor component embedded in a car, e-car or e-loc for example, requires a proper and reliable thermal management solution, including thermal interface materials.

DynTIM the Mentor Graphics thermal interface material tester provides a robust industrial technique to measure thermal conductivity of TIM materials. The structure function methodology helps locate the contribution of the TIM tested to the total thermal resistance of the measurement setup – similar to real life in-situ testing of a power semiconductor device. DynTIM thus is an extension of the well-proven T3Ster technology – a unique combination of thermal transient measurements with the classical ASTM TIM testing principles. Application of DynTIM allows manufacturers of different vehicles to double check data provided by material suppliers and obtain TIM material for building system level thermal simulation models for CFD analysis.

  • Automated test method, providing the benefits of thermal transient testing combined with the principles of classical TIM testing methods
  • Quasi in-situ material property testing of different kinds of TIM materials
  • Measured TIM thermal conductivity propagated towards our CFD simulation tools such as FloTHERM
Cumulative structure function(s)
Cumulative structure function(s)

Material Manufacturing

Manufacturers of thermal interface materials are facing the challenges of a highly innovative market. New solutions are being researched in order to increase the bulk thermal conductivity coefficient, reduce the bond-line thickness and the contact resistance in today’s cutting edge materials. Before the introduction of these new materials to the market, accurate datasheet values have to be derived, and the long-term behavior of the materials has to be tested. Better materials mean lower thermal resistances, which are increasingly hard to measure.

The DynTIM thermal interface material tester provides a robust industrial technique to measure thermal conductivity of TIM materials. The structure function methodology helps locate the contribution of the TIM tested to the total thermal resistance of the measurement setup – similar to real life in-situ testing of a power semiconductor device.

DynTIM is an extension of the well-proven T3Ster technology – a unique combination of thermal transient measurements with the classical ASTM TIM testing principles. This combination also allows the identification of the bulk thermal conductivity coefficient of TIMs, and even long term measurements providing information about their possible degradations.

  • Automated test method, providing the benefits of thermal transient testing combined with the principles of classical TIM testing methods
  • Precise BLT control, optional pressure sweep
  • Quasi in-situ material property testing of different kinds of TIM materials
  • Measured TIM thermal conductivity propagated towards our CFD simulation tools such as FloTHERM

Solid-State Lighting

Cool LEDs emit more light and live longer. To achieve this combination, engineers need to reduce the junction-to-ambient thermal resistance in an LED. The major contributors to this thermal resistance are the different interfacial thermal resistance between two mating surfaces in the complete cooling assembly of an LED. Thermal interface materials are used to reduce such interfacial resistances.

To allow proper design of the LED, access to precise data about thermal conductivity of the applied thermal interface materials is of paramount importance. By using the DynTIM thermal interface material tester one can obtain this information independent of vendors’ data sheets. The DynTIM software utility also allows usage of the identified TIM thermal conductivity values for FloTHERM CFD simulation to allow proper thermal modeling of an LED application such as simulation of complete luminaires.

  • Quasi in-situ method to measure precise TIM thermal conductivity data
  • Based on the proven T3Ster measurement technology and structure function
  • Link towards CFD simulation by allowing exact TIM thermal conductivity values
 
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