Accurate Component Junction and Case Temperature

Overview

This session will discuss why it is useful to characterize the thermal properties of a component and what modeling methods are available. The pros and cons of the different methods and in what situations they may be appropriate will also be covered.

As the drive for smaller, faster products increases, the thermal engineer is continually pushed to create effective heat removal designs. The thermal performance of electronic components is an important consideration during this design process. How to model the components effectively while minimizing computational effort and maximizing useful accurate results is a balancing act that many thermal engineers will be familiar. There are many reasons for thermally characterizing an IC and many methods to do so.

What You Will Learn

• Why we need to characterize a component
• What different types of characterization exist
• When it is appropriate to use the different types of characterization

Who Should View

• Thermal engineers
• System designers
• Anyone who needs to represent ICs in CFD

Related Industries

• Semiconductors