Accurate Component Junction and Case Temperature
On-demand Web Seminar
Abstract
This web seminar will discuss why it is useful to characterize the thermal properties of a component and what modeling methods are available.
Duration: 16:04
Details
Overview
This session will discuss why it is useful to characterize the thermal properties of a component and what modeling methods are available. The pros and cons of the different methods and in what situations they may be appropriate will also be covered.
As the drive for smaller, faster products increases, the thermal engineer is continually pushed to create effective heat removal designs. The thermal performance of electronic components is an important consideration during this design process. How to model the components effectively while minimizing computational effort and maximizing useful accurate results is a balancing act that many thermal engineers will be familiar. There are many reasons for thermally characterizing an IC and many methods to do so.
What You Will Learn
- Why we need to characterize a component
- What different types of characterization exist
- When it is appropriate to use the different types of characterization
About the Presenter
Kelly Cordell-Morris
Kelly gained a MEng in Aeronautical Engineering at Imperial College, London in 2000. Kelly has worked for Mentor Graphics for over 4 years, initially as a Senior Engineer and now as a Corporate Application Engineer concentrating on providing technical support on all the Mechanical Analysis Division products. Her prior work includes research into containing and filtering air from smoking areas and research and development on gas turbine filtration equipment.
Who Should View
- Thermal engineers
- System designers
- Anyone who needs to represent ICs in CFD
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