Component Thermal Characterization Made Easy
On-demand Web Seminar
In order to properly design thermal solutions for IC components a complete understanding of the thermal performance must be understood. For IC component thermal characterizations there are trade-offs and benefits with both the analytical and experimental approaches. To accurately characterize the thermal performance of an IC package both methods are necessary, but understanding each method strengths is required to achieve the most benefit.
What You Will Learn
- An understanding of the strengths of measurement and analysis when determining the thermal performance of an IC package and the various thermal performance metrics
- How to use test to determine IC component failure
- What is necessary to develop a robust Comact Thermal Model (CTM)
About the Presenter
John Wilson joined Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) after receiving his BS and MS in Mechanical Engineering from the University of Colorado at Denver. Since joining in 1999, John has worked on or managed more than 70 thermal and airflow design projects.
His modeling and design knowledge range from component level to Data Centers, heat sink optimization and compact model development. John has extensive experience in IC package level test and analysis correlation through his work at Mentor Graphics' Fremont based Thermal Test Facility.
He is currently the Application Engineering Manager, in the Western Region, for the Mechanical Analysis Division.
Who Should View
- Thermal engineers
- Mechanical engineers
- Those responsible for designing thermal ICs
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