Using FloTHERM to Assist Thermally Optimized Die Design in the Auto Industry
On-demand Web Seminar
This presentation highlights how FloTHERM is used to assist in thermally optimized die design. Topics include a quick summary of how FloTHERM is used to help analyze the general automotive environment and power requirements from a thermal perspective and how results and recommendations are shared with customers.
In the automotive safety industry the current drive has been for smaller assemblies with lower part counts. This small size and reduced part count forces semiconductor providers to include more functions and higher power in semiconductor devices. With these added functions comes higher temperatures that can affect reliability and in turn, automotive safety.
By optimizing the die layout and power pulse timing early in the design cycle, designers can provide a more reliable design with fewer silicon test builds, leading to a cost savings and a shorter design cycle Thermal simulation provides guidance to the product designer on issues related to thermal performance and enables them to create products that meet real-world operating conditions.
Duration: 28 minutes
What You Will Learn
- Thermal limitations for design in the automotive industry
- Test variations in layout
- Thermal simulation results sharing
About the Presenter
Sandra joined the Analogue Packaging Group at Texas Instruments as a Co-Op in 1993. Since 2003, Sandra has established herself a leadership position in Thermal Modeling and has served as co-chair of the Texas Instruments Thermal Council since 2007. Sandra supports customer and development models for the Analogue Group at TI including the Automotive Product Group.
Who Should View
- Mechanical Engineers
- Die-level Designers
- Engineers using highly complex CFD tools
- Engineers who are designing the next-generation electronics for automobiles
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