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Multimedia Resource Center

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Featured Multimedia

Parmetric Study of an IGBT Cold Plate Geometry in a Thermal Simulation


Technology Overview: The CAD design of a cold plate for automotive power electronics is the key for an efficient cooling. A parametric study of the cold plate design was conducted to find the optimum geometry parameters such... 25:27

Tags: IESF

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Laser Headlamps: Latest Developments and Future Prospect


Technology Overview: As LEDs are gradually setting standards in automotive head-lighting, we already have seen examples of laser headlamps touted as the future of high end automotive lighting. A diode laser pumped remote phosphor... 33:00

Tags: IESF

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Effects of Power Cycling Tests on Power Electronics Components


On-demand Web Seminar: Learn how to use the combination of power cycling testing and thermal transient measurement to understand power module reliability. 23:02

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MicReD Industrial Power Tester 1500A


Technology Overview: The MicReD Industrial Power Tester 1500A tests the reliability of power electronic components. It is the only commercially available thermal testing product that combines both power cycling and thermal... 02:37

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Selecting the right Thermal Interface Material (TIM) for electronics packages based on accurate thermal measurement data


Technology Overview: Learn why understanding the heat flow path, accurate thermal property information is key in selecting TIMs appropriately for successful thermal design.  24:12

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Introduction to DynTIM


On-demand Web Seminar: A complimentary on-line web seminar on how and why to use the new DynTIM product from Mentor Graphics. 27:30

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Quality Control at the Electronic Package and System Levels


On-demand Web Seminar: In this webinar a measurement methodology will be introduced which enables the appropriate thermal modeling of the situation described above in conjunction with the highly accurate measurement of the junction... 50:14

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Using Measurement Data in Electronics Thermal Design - T3Ster CTM generation and detailed FloTHERM model calibration


On-demand Web Seminar: This webinar will introduce the concept of structure functions and their derivation as well as presenting two ways in which experimental IC package studies can be effectively used in conjunction with numerical... 19:35

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Thermal testing standards: JEDEC Standards – What’s the latest news?


On-demand Web Seminar: This webinar aims at introducing existing thermal testing standards for packaged semiconductor devices: an overview of thermal metrics, test methods and test environments will be given. The basic concept... 57:06

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LED Thermal Characterization Made Easy


On-demand Web Seminar: The webinar will introduce the principles of thermal transient testing – as a general method of semiconductor package characterization by means of physical measurement. 01:21:06

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T3Ster Validation of Thermal Models of IC Packages and More


On-demand Web Seminar: Learn how Thermal Transient Tester (T3Ster) equipment can be used to generate Compact Thermal Models (CTMs) for use in thermal design to improve junction temperature prediction. 57:00

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Understanding the thermal impedances in power LED applications


On-demand Web Seminar: Understanding the thermal impedances in power LED applications 01:07:20

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