Optimize Chassis, Venting and Airflow Design in Electronics Enclosures

Overview

During this 45-minute presentation, we will show you how simulation can help you optimize airflow and resolve heat transfer issues inside electronics enclosures.

A wide range of topics will be discussed including changing the chassis shape, modifying the layout, as well as changing fans, heatsinks and guide vanes. As design for manufacturability and cost are always key factors in the decision-making process, we will also spend some time on how you can optimize the design while aiming to reduce costs. Design engineers involved in designing electronics enclosures would find this session very educational.

Optimizing airflow in and around electronics is a key area of concern regardless of project size: whether it’s a 50,000 square foot data center, a high-powered board placed inside a computer or any other type of electronics device. Any change, however minute, to the chassis, layout and components can dramatically alter the thermal and flow behavior inside the electronics enclosure. Simulation is the key to ensuring that the right amount of natural or forced ventilation is delivered to the various components and in the most effective way possible.

What You Will Learn

• Reduce the delta T through an electronics application through modifications made to the chassis and venting
• Visualize the change in airflow and thermal behavior with every design alteration and understand the underlying causes of problems
• Quickly set-up various what-if scenarios for analysis
• Use sequential optimization by specifying a design goal and letting the software automatically optimize for form, fit, function, cost, material and more
• Select the best design generated from quantified outputs

Who Should View

• Engineers who have thermal problems with electronic based applications
• Technical Managers, Thermal Engineers as well as Board and Chassis Engineers