Sign In
Forgot Password?
Sign In | | Create Account

Optimize Chassis, Venting and Airflow Design in Electronics Enclosures



During this 45-minute presentation, we will show you how simulation can help you optimize airflow and resolve heat transfer issues inside electronics enclosures.

A wide range of topics will be discussed including changing the chassis shape, modifying the layout, as well as changing fans, heatsinks and guide vanes. As design for manufacturability and cost are always key factors in the decision-making process, we will also spend some time on how you can optimize the design while aiming to reduce costs. Design engineers involved in designing electronics enclosures would find this session very educational.

Optimizing airflow in and around electronics is a key area of concern regardless of project size: whether it’s a 50,000 square foot data center, a high-powered board placed inside a computer or any other type of electronics device. Any change, however minute, to the chassis, layout and components can dramatically alter the thermal and flow behavior inside the electronics enclosure. Simulation is the key to ensuring that the right amount of natural or forced ventilation is delivered to the various components and in the most effective way possible.

What You Will Learn

  • Reduce the delta T through an electronics application through modifications made to the chassis and venting
  • Visualize the change in airflow and thermal behavior with every design alteration and understand the underlying causes of problems
  • Quickly set-up various what-if scenarios for analysis
  • Use sequential optimization by specifying a design goal and letting the software automatically optimize for form, fit, function, cost, material and more
  • Select the best design generated from quantified outputs

About the Presenter

Presenter Image Martin Pearse

Located in the divisions head office in Hampton Court, London, Martin is an Application Engineer with the Mechanical Analysis Division and has been with the organisation for 3 years. Martin holds a BEng degree in ‘Motor Sport Engineering’ which he gained from the University of Central Lancashire and has been heavily involved with Computational Fluid Dynamics (CFD) since 2004.

Who Should View

  • Engineers who have thermal problems with electronic based applications
  • Technical Managers, Thermal Engineers as well as Board and Chassis Engineers

Related Industries

Related Resources


Other Related Resources

Q and A Transcript

Q: How many grid cells has such a model?
A: ~2.5 million.
Q: How long does the model take to solve typically?
A: The base cases were solved over night. Additional runs in Command Center initialized from previous scenarios saving time ~2hours to solve.
Q: What’s the advantage compared to FloWorks included in the solid works package?
A: The list is extensive, FloTHERM is fully tailored to Electronics cooling applications. No optimizer available in FloWorks. Other advantages exist.
Q: I have 3D models from ProE. Which way I assign temperatture data to mechanical models?
A: 3D model imported and transferred via MCAD window. Then thermal attributes can be assigned in the Project Manager window.
Q: Working with thermal gap fillers, can we specify these or is there a library for these available also?
A: These can be configured via the surface menu for that cuboids’ Rsurf-fluid etc.
Q: Is the material of the case and it's thermal conductivity taken into consideration?
A: This demo used a lumped component method. However more detail can be made to the chips in question. SmartParts to aid detail modeling, also FloTHERMPack can construct models.
Q: What about PRO E - can you take PRO E geometry?
A: Yes PRO-E, others are IGES, STL, SAT, STEP, CATIA V4 & V5, DXF and SolidWorks.
Q: Are these monitor points the target temperature comparing points?
A: Yes.
Q: Where is the 3D modeling done?
A: 3D models can be built fully in FloTHERM via construction windows. CAD outputs from packages such as SolidWorks, Catia etc can be imported and converted, other generic types such as parasolid can also be used.
Q: Please what about interface temperatures?
A: Interface temperatures can be retrieved between materials.
Q: Are there ways to specify fan parameters?
A: Numerous fan configurations can be modeled in differing levels of detail. Fixed flow, fan curve, swirl etc can all be specified.
Online Chat