Heatsink 201 - Even More About Heatsink Design
On-demand Web Seminar
Abstract
This session is a continuation on from Heatsink 101, during this presentation we will dig deeper into how heatsinks work and discuss why they are not as simple as they look.
Duration: 28:27
Details
Overview
In this webinar we will discuss how manufacturer’s data is obtained, and why this may not be applicable for use in design by showing a simple example of how a heatsink interacts locally with the surrounding airflow.
We will illustrate why heatsinks are not as simple to use as they first appear, and why they should be designed for a particular application. We will also talk more about the myths surrounding heatsinks and their application, and give some practical advice concerning heatsink design and attachment. The presentation will conclude by looking at different optimization strategies for heatsink design.
This session is a continuation on from Heatsink 101, during this 45 minute presentation we will dig deeper into how heatsinks work and discuss why they are not as simple as they look. Before you listen to this presentation we suggest you listen to Heatsink 101. Engineers involved in board and chassis design will find the video demonstrating heatsink design optimization using simulation particularly educational.
What You Will Learn
- Why heatsinks are not as easy to use in practice as they first appear
- How to design a heatsink in context, i.e. for a specific electronics cooling application
- How airflow interacts with a heatsink, helping you understand heatsink behavior
- Practical issues in the design and use of heatsinks
- Optimization strategies to achieve the most appropriate heatsink design
Q and A Transcript
Q and A Transcript: Heatsink 201 - Even More About Heatsink Design
About the Presenter
Dr. John Parry, CEng.
John Parry joined Mentor Graphics’ Mechanical Analysis Division (formerly Flomerics) in 1989 as the head of the Customer Services department. After four years, John moved to the Research department and he has been managing the division’s research activities since 1997.
Having published many technical papers over the years, John’s technical contributions include the development of compact thermal models for fans, heat sinks and chip packages. He is also a subject-matter expert in the application of Design of Experiment and optimisation techniques.
John serves on several conference committees. He was the General Chair of SEMI-THERM 21 and currently represents the Mechanical Analysis Division in the JEDEC committee on thermal standards.
Who Should View
- Engineers who have thermal problems with electronics-based applications
- CAD, CAE and other Technical Managers with product thermal responsibility
- Thermal Engineers
- Mechanical Engineers
- Mechanical Designers Board and Chassis Designers
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