Thermal testing standards: JEDEC Standards – What’s the latest news?
On-demand Web Seminar
Industrial solutions need standards. Standards on one hand make sure that an idea or a method can be implemented by anybody. On the other hand, industrial standards give confidence to end-users that the product or service that they pay for meet certain minimal requirements, therefore products from two different vendors conforming to the same industrial standard could work in the same system. The purpose of standards is just the same in thermal testing.
This webinar aims at introducing existing thermal testing standards for packaged semiconductor devices: an overview of thermal metrics, test methods and test environments will be given. The basic concept of the most recent JEDEC standard, the transient dual interface method for the measurement of junction-to-case thermal resistance will be provided – with the help of Mentor Graphics MicReD hardware and software tools. A few words on test based compact modeling will be given along with an introduction how these models can be used in Mentor Graphics' FloTHERM program. Recent news on emerging LED testing standards will also be given.
What You Will Learn
- JEDEC JESD51 series of thermal testing standards: thermal metrics, test methods, test environments
- What are the benefits of the transient test methods compared to the classical static test methods
- JESD51-14, the first transient thermal testing standard launched by JEDEC will be discussed
- New emerging LED thermal testing standards will also be introduced
- Concept of compact thermal modeling based on JEDEC compact modeling guidelines
- Concept of test based compact modeling realized by Mentor Graphics' T3Ster and FloTHERM products
About the Presenter
András POPPE obtained his MSc degree in electrical engineering in 1986 from the Budapest University of Tecnology (BME), Faculty of Electrical Engineering.In 1996 he obtained a Cand.Sci. degree from the Hungarian Academy of Sciences and his PhD from TUB. Between 1986 and 1989 he was a researcher at BME Department of Electron Devices with scholarship of the Hungarian Academy of Sciences. His research filed was circuit simulation and semiconductor device modeling. In the academic year 1989-1990 he was a guest researcher at IMEC (Leuven, Belgium) where he was dealing with mobility modeling for the purpose of device simulation, postgraduate studies at KUL (Katholike Universiteit Leuven). Since 1990 he is with the Budapest University of Tecnology, Department of Electron Devices. In 1991/94 has been active in the Monte Carlo simulation of submicron MOS devices. Since 1996 he has been working at BME as an associate professor. In 1997 he was one of the co-founders of MicReD, now Mentor Graphics MicReD Division. At Mentor Graphics today he supports marketing of the MicReD products T3Ster TeraLED. Besides his academic activities he is involved in various national and international research projects (e.g. EU FW7 Fast2Light, KÖZLED, EU FW7 NANOPACK). He is actively involved in the JEDEC JC15 and CIE TC2-63 and TC2-64 standardization committees. His fields of interest include thermal transient testing of packaged semiconductor devices, characterization of LEDs and OLEDs, electro-thermal simulation.
Who Should View
- Thermal engineers dealing thermal testing, modeling and simulation
- Package designers, system designers, application designers
- Experts in reliability testing
Introduction to Thermal Simulation of Electronics
An introduction to why Thermal Analysis is so important in the design of Electronic Products, and why CFD is used in the design process to save time and money.…
Parametric Study of an IGBT Cold Plate Geometry in a Thermal Simulation
The CAD design of a cold plate for automotive power electronics is the key for an efficient cooling. A parametric study of the cold plate design was conducted to find the optimum geometry parameters such...…
Feel the Heat in the Automotive Industry: Thermal Simulation as an integral part of the Design Process
Today’s automotive products have to be in line with the automotive industry's megatrends that make driving safer, more comfortable and more sustainable. High performance products, such as Navigation-,...…
Other Related Resources
How to Predict Component Temperatures for Complex Network and Telecommunications Equipment
White Paper: The insides of network and telecom equipment consist of a complex assembly of many solid objects (PCBs, electronics packages and devices, cabling, fans, and heatsinks, for example). Airflow is confined...…
Identifying Optimal Thermal Designs for Network and Telecommunications Equipment
White Paper: Networking and telecom systems need to run 24/7, and an unreliable system can expose the system supplier to significant warranty, recall, and reputation costs. More functionality and higher performing electronic...…
How to Optimize PCB Thermal Design for Complex Network and Telecommunications Equipment
White Paper: Networking and telecom systems need to run 24/7, and continually increasing computing requirements and network traffic are increasing power densities in enclosures and on boards. These demands require ever-more...…