Thermal testing standards: JEDEC Standards – What’s the latest news?
On-demand Web Seminar
Industrial solutions need standards. Standards on one hand make sure that an idea or a method can be implemented by anybody. On the other hand, industrial standards give confidence to end-users that the product or service that they pay for meet certain minimal requirements, therefore products from two different vendors conforming to the same industrial standard could work in the same system. The purpose of standards is just the same in thermal testing.
This webinar aims at introducing existing thermal testing standards for packaged semiconductor devices: an overview of thermal metrics, test methods and test environments will be given. The basic concept of the most recent JEDEC standard, the transient dual interface method for the measurement of junction-to-case thermal resistance will be provided – with the help of Mentor Graphics MicReD hardware and software tools. A few words on test based compact modeling will be given along with an introduction how these models can be used in Mentor Graphics' FloTHERM program. Recent news on emerging LED testing standards will also be given.
What You Will Learn
- JEDEC JESD51 series of thermal testing standards: thermal metrics, test methods, test environments
- What are the benefits of the transient test methods compared to the classical static test methods
- JESD51-14, the first transient thermal testing standard launched by JEDEC will be discussed
- New emerging LED thermal testing standards will also be introduced
- Concept of compact thermal modeling based on JEDEC compact modeling guidelines
- Concept of test based compact modeling realized by Mentor Graphics' T3Ster and FloTHERM products
About the Presenter
András POPPE obtained his MSc degree in electrical engineering in 1986 from the Budapest University of Tecnology (BME), Faculty of Electrical Engineering.In 1996 he obtained a Cand.Sci. degree from the Hungarian Academy of Sciences and his PhD from TUB. Between 1986 and 1989 he was a researcher at BME Department of Electron Devices with scholarship of the Hungarian Academy of Sciences. His research filed was circuit simulation and semiconductor device modeling. In the academic year 1989-1990 he was a guest researcher at IMEC (Leuven, Belgium) where he was dealing with mobility modeling for the purpose of device simulation, postgraduate studies at KUL (Katholike Universiteit Leuven). Since 1990 he is with the Budapest University of Tecnology, Department of Electron Devices. In 1991/94 has been active in the Monte Carlo simulation of submicron MOS devices. Since 1996 he has been working at BME as an associate professor. In 1997 he was one of the co-founders of MicReD, now Mentor Graphics MicReD Division. At Mentor Graphics today he supports marketing of the MicReD products T3Ster TeraLED. Besides his academic activities he is involved in various national and international research projects (e.g. EU FW7 Fast2Light, KÖZLED, EU FW7 NANOPACK). He is actively involved in the JEDEC JC15 and CIE TC2-63 and TC2-64 standardization committees. His fields of interest include thermal transient testing of packaged semiconductor devices, characterization of LEDs and OLEDs, electro-thermal simulation.
Who Should View
- Thermal engineers dealing thermal testing, modeling and simulation
- Package designers, system designers, application designers
- Experts in reliability testing
This webinar provides an up to date picture of the state of simulation driven design by sharing findings from a 2013 study. …View On-demand Web Seminar
Learn how to automate aspects of your thermal design with FloTHERM v10.0 to increase productivity and shorten the thermal design process.…View On-demand Web Seminar
Other Related Resources
White Paper: Why is Enclosure Thermal Design Important? Before we look at the 12 key considerations in enclosure thermal design let´s first consider why thermal issues need to be considered at the system, or enclosure...…View White Paper
White Paper: Many aspects of a PCB’s performance are determined during detailed design, e.g. making a trace a specific length for timing reasons. Timing issues are also affected by temperature differences between components....…View White Paper
White Paper: When is Data Center Thermal Design Important? The usage of data centers globally has skyrocketed in the past three to four years in response to growing demand for information storage and transfer from banks,...…View White Paper