Thermal testing standards: JEDEC Standards – What’s the latest news?

Overview

Industrial solutions need standards. Standards on one hand make sure that an idea or a method can be implemented by anybody. On the other hand, industrial standards give confidence to end-users that the product or service that they pay for meet certain minimal requirements, therefore products from two different vendors conforming to the same industrial standard could work in the same system. The purpose of standards is just the same in thermal testing.

This webinar aims at introducing existing thermal testing standards for packaged semiconductor devices: an overview of thermal metrics, test methods and test environments will be given. The basic concept of the most recent JEDEC standard, the transient dual interface method for the measurement of junction-to-case thermal resistance will be provided – with the help of Mentor Graphics MicReD hardware and software tools. A few words on test based compact modeling will be given along with an introduction how these models can be used in Mentor Graphics' FloTHERM program. Recent news on emerging LED testing standards will also be given.

What You Will Learn

• JEDEC JESD51 series of thermal testing standards: thermal metrics, test methods, test environments
• What are the benefits of the transient test methods compared to the classical static test methods
• JESD51-14, the first transient thermal testing standard launched by JEDEC will be discussed
• New emerging LED thermal testing standards will also be introduced
• Concept of compact thermal modeling based on JEDEC compact modeling guidelines
• Concept of test based compact modeling realized by Mentor Graphics' T3Ster and FloTHERM products

Who Should View

• Thermal engineers dealing thermal testing, modeling and simulation
• Package designers, system designers, application designers
• Experts in reliability testing