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LED Thermal Characterization Made Easy



The webinar will introduce the principles of thermal transient testing – as a general method of semiconductor package characterization by means of physical measurement.

The features of the T3Ster system, the Mentor Graphics MicReD implementation of this test by means of the JEDEC JESD51-1 static test method will be discussed in detail along with the concept of thermal impedances (driving point impedance, transfer impedances). The unique thermal transient results, post-processing technology resulting in structure functions, and dynamic compact thermal models of packages will also be covered. The new de facto standard of the junction-to-case thermal resistance (RthJC) measurement of power semiconductors – such as power LEDs – based on the so called dual interface method will be shown. This method is also based on structure functions and it is likely to become a new JEDEC standard.

When speaking about LEDs, light output also needs to be measured for two reasons:

  1. To consider the emitted optical power when calculating the real thermal resistance of LEDs.
  2. Junction temperature dependence of the light output characteristics and the efficiency/efficacy for accurate hot lumen predictions.

The concept of Mentor Graphics solution of the combined thermal and radiometric measurement of LEDs and its implementation called T3Ster® TeraLED® will also be shown along with some measurement results obtained by this fully-automated system.

About the Presenter

Presenter Image András Poppe

András POPPE obtained his MSc degree in electrical engineering in 1986 from the Budapest University of Tecnology (BME), Faculty of Electrical Engineering.In 1996 he obtained a Cand.Sci. degree from the Hungarian Academy of Sciences and his PhD from TUB. Between 1986 and 1989 he was a researcher at BME Department of Electron Devices with scholarship of the Hungarian Academy of Sciences. His research filed was circuit simulation and semiconductor device modeling. In the academic year 1989-1990 he was a guest researcher at IMEC (Leuven, Belgium) where he was dealing with mobility modeling for the purpose of device simulation, postgraduate studies at KUL (Katholike Universiteit Leuven). Since 1990 he is with the Budapest University of Tecnology, Department of Electron Devices. In 1991/94 has been active in the Monte Carlo simulation of submicron MOS devices. Since 1996 he has been working at BME as an associate professor. In 1997 he was one of the co-founders of MicReD, now Mentor Graphics MicReD Division. At Mentor Graphics today he supports marketing of the MicReD products T3Ster TeraLED. Besides his academic activities he is involved in various national and international research projects (e.g. EU FW7 Fast2Light, KÖZLED, EU FW7 NANOPACK). He is actively involved in the JEDEC JC15 and CIE TC2-63 and TC2-64 standardization committees. His fields of interest include thermal transient testing of packaged semiconductor devices, characterization of LEDs and OLEDs, electro-thermal simulation.

Who Should View

  • Thermal engineers dealing with LED based applications
  • LED package designers
  • Experts in LED reliability testing
  • Luminaire designers, lighting application designers

What You Will Learn

  • How to measure thermal characteristics of power LEDs, LED lines and assemblies such as an RGB module
  • How to perform structural analysis of power LED packages using structure functions
  • How to generate compact thermal models of power LED packages to be used e.g. in CFD simulation
  • How to perform measurement of the temperature dependence of light output metrics of LEDs

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