Sign In
Forgot Password?
Sign In | | Create Account

Long Term Reliability in Electronic Systems



The webinar will give an introduction to thermally induced failure mechanisms within the package region of the chip and also outside at the cooling structures.

An overview will be given how failures such as die attach delamination, cracks, grease pump-out, etc. develop due to high temperature and temperature cycling. It will be explained in details how the cooling path from the junction of a semiconductor towards the ambient can be characterized, to make sure that the chip temperature does not reach critical levels.

In the second section of the presentation I will introduce standard reliability test methods to verify the long term behavior of a packaged device, or even a whole electric system. A special emphasize will be put on role of TIM (Thermal Interface Material) materials in the long term reliability of power semiconductors. Ideas and examples will be given, how the so-called structure functions can be applied to define a failure criteria which makes it possible to decide whether the tested system would work reliably on the long run or not.

Short cases studies will be shown on the possible reliability test methods of LEDs and thermal interface materials.

What You Will Learn

  • The effect of bad thermal management on the lifetime of an electrical system
  • Overview of temperature induced failure mechanisms in electrical systems
  • Transient and steady-state thermal characterization of electric assemblies
  • Overview will be given on accelerated reliability tests
  • A possible definition of the failure criteria for the degradation of thermal interface materials
  • A structure-function based evaluation of die attach failures

About the Presenter

Presenter Image Andras Vass-Varnai

Andras Vass-Varnai obtained his MSc degree in electrical engineering in 2007 at the Budapest University of Technology and Economics. He works as a technical marketing engineer at the MicReD Division at Mentor Graphics since. Beside his work he is also a correspondent Ph.D. student at the Technical University of Budapest. His main topics of interest include thermal management of electric systems, advanced applications of thermal transient testing, characterization of TIM materials and high power semiconductor devices.

Who Should View

  • Engineers interested in reliability issues
  • System designers of electronic systems with high power density
  • Thermal engineers
  • TIM manufacturers and end-users


Related Resources


Quality Control at the Electronic Package and System Levels

In this webinar a measurement methodology will be introduced which enables the appropriate thermal modeling of the situation described above in conjunction with the highly accurate measurement of the junction...…View On-demand Web Seminar

Using Measurement Data in Electronics Thermal Design - T3Ster CTM generation and detailed FloTHERM model calibration

This webinar will introduce the concept of structure functions and their derivation as well as presenting two ways in which experimental IC package studies can be effectively used in conjunction with numerical...…View On-demand Web Seminar

LED Thermal Characterization Made Easy

The webinar will introduce the principles of thermal transient testing – as a general method of semiconductor package characterization by means of physical measurement.…View On-demand Web Seminar

Other Related Resources

Tackling the Thermal Design Challenges of Smaller, Lighter, and More Efficient Avionics

White Paper: With every Kelvin increase in temperature, the risk of avionic component failure increases. For civil and military applications, the thermal characteristics of avionic components directly influence overall...…View White Paper

New Method for Characterizing Thermal Interface Materials in an In Situ Environment

White Paper: A new method based on existing measurement standards for a quick and repeatable thermal conductivity measurement of nanoparticle-based thermal greases and other compressible thermal interface materials...…View White Paper

Ten Good Reasons Why Thermal Measurements are Important to Your Design

White Paper: The Mentor Graphics MicReD T3Ster, a best-in-class thermal measurement system, is fully equipped to deliver the efficiency, repeatability, flexibility, and ease of use needed for this application. There...…View White Paper

Online Chat