Long Term Reliability in Electronic Systems
On-demand Web Seminar
The webinar will give an introduction to thermally induced failure mechanisms within the package region of the chip and also outside at the cooling structures.
An overview will be given how failures such as die attach delamination, cracks, grease pump-out, etc. develop due to high temperature and temperature cycling. It will be explained in details how the cooling path from the junction of a semiconductor towards the ambient can be characterized, to make sure that the chip temperature does not reach critical levels.
In the second section of the presentation I will introduce standard reliability test methods to verify the long term behavior of a packaged device, or even a whole electric system. A special emphasize will be put on role of TIM (Thermal Interface Material) materials in the long term reliability of power semiconductors. Ideas and examples will be given, how the so-called structure functions can be applied to define a failure criteria which makes it possible to decide whether the tested system would work reliably on the long run or not.
Short cases studies will be shown on the possible reliability test methods of LEDs and thermal interface materials.
What You Will Learn
- The effect of bad thermal management on the lifetime of an electrical system
- Overview of temperature induced failure mechanisms in electrical systems
- Transient and steady-state thermal characterization of electric assemblies
- Overview will be given on accelerated reliability tests
- A possible definition of the failure criteria for the degradation of thermal interface materials
- A structure-function based evaluation of die attach failures
About the Presenter
Andras Vass-Varnai obtained his MSc degree in electrical engineering in 2007 at the Budapest University of Technology and Economics. He is a Product Manager in the MicReD Division at Mentor Graphics. Beside his work he is also a correspondent Ph.D. student at the Technical University of Budapest. His main topics of interest include thermal management of electric systems, advanced applications of thermal transient testing, characterization of TIM materials and high power semiconductor devices.
Who Should View
- Engineers interested in reliability issues
- System designers of electronic systems with high power density
- Thermal engineers
- TIM manufacturers and end-users
IGBT Power Cycling and Failure Mode Tracking
This presentation will explain Mentor’s latest product, the Power Tester 1500A, of the MicReD product line and explain its application in the testing of IGBTs as they are used in EVs and HEVs. We...…
Winding Parameter Variations for the Cooling of an Electrical Motor
Flow and thermal calculations have been performed with FloEFD for different winding configurations of the motor. The bar winding is simulated with its copper and insulation layers whereas the composite...…
Other Related Resources
The Third Wave of CFD
White Paper: In the history of the simulation of flow, heat and mass transfer processes for the development of products and processes, several phases can be observed: an early phase of the first commercial codes from...…
Power Cycling & Thermal Failure Measurements of Power Electronics in Wind Turbines
White Paper: Today, in Europe alone about 10% of all power generation is via wind power and it is expected to rise to 20% by 2020. However, wind turbine power electronics has to be designed with a 25 year lifetime in...…