PCB Thermal Simulation - The State of the Art

Details

Overview

Over the past 20 years 3D based CFD simulation has become an integral part of the electronics design process. Whereas thermal management has historically been dealt with at the mechanical system level, the trend towards increased functional density and miniaturisation has forced the thermal management challenge down to PCB and component scales.

Decreasing design margins have increased the need for more accurate junction and case component temperature prediction. This in turn has demanded a much more detailed thermal representation of the PCB itself driving the recent improvements in PCB thermal modeling discussed in this seminar.

What You Will Learn

  • An appreciation of the issues involved in PCB level thermal simulation
  • What level of detail is required to achieve useful simulation results

About the Presenter

Presenter Image Dr. Robin Bornoff

Robin achieved his Mechanical Engineering Degree from Brunel University in 1992. He was awarded his PhD from Brunel University in 1995 for CFD research. Robin joined Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) after his PhD as an application and support engineer, specializing in the application of CFD to electronics cooling and the design of the built environment. He is now the Product Manager responsible for the FloTHERM, FloVENT and FloTHERM.PCBs software.

Who Should View

  • Mechanical engineers
  • Thermal engineers
  • Electrical engineers

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