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Reducing PCB Respins



This webinar will show you why and how to best incorporate thermal constraints into an existing design flow.

It's standard practice to develop electrical and mechanical constraints at a very early stage in the design of electronics and enforce them all the way through to shipping the product. Every bit as important, but less frequently practiced, is the development and enforcement of thermal constraints (ie, maximum allowable temperatures) in the design flow.

Given the complexity and thermal densities of today's electronic products, failure to enforce thermal constraints concurrently with electrical and mechanical constraints is a risky strategy. The 'thermal bandaid' approach (ie, leaving all thermal re-design cycles until the end) can be extremely costly and time consuming.

What You Will Learn

  • How to develop thermal constraints
  • How to incorporate thermal constraints into a design flow
  • Why late thermal fixes adversely affect the design flow

About the Presenter

Presenter Image Byron Blackmore

Product Manager – Electronics Cooling
Mentor Graphics, Mechanical Analysis Division

Byron Blackmore is currently the Product Manager for FloTHERM PCB. Byron has been with Flomerics/Mechanical Analysis Division for 9 years, and has previously acted as the Electronics Cooling Engineering Supervisor for North America. He has a BS in Mechanical Engineering from the Technical University of Nova Scotia and an MS in Mechanical Engineering with a concentration in fluid dynamics and heat transfer from the University of Alberta.

Who Should View

  • Those responsible for electronics design flow efficiency or those responsible for thermal management
  • PCB Designers
  • Thermal Engineers

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